UVPROM, 128KX8, 50ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| Parts packaging code | DIP |
| package instruction | WDIP, DIP32,.6 |
| Contacts | 32 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Is Samacsys | N |
| Maximum access time | 50 ns |
| I/O type | COMMON |
| JESD-30 code | R-GDIP-T32 |
| JESD-609 code | e0 |
| length | 42.1005 mm |
| memory density | 1048576 bit |
| Memory IC Type | UVPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 32 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 128KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | WDIP |
| Encapsulate equivalent code | DIP32,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, WINDOW |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.588 mm |
| Maximum standby current | 0.001 A |
| Maximum slew rate | 0.1 mA |
| Maximum supply voltage (Vsup) | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| Base Number Matches | 1 |
| AM27HB010-50V05DCB | AM27HB010-60V05JC | AM27HB010-60V05PC | AM27HB010-50V05DC | AM27HB010-50V05LC | AM27HB010-50V05LCB | |
|---|---|---|---|---|---|---|
| Description | UVPROM, 128KX8, 50ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | OTP ROM, 128KX8, 60ns, CMOS, PQCC32, PLASTIC, LCC-32 | OTP ROM, 128KX8, 60ns, CMOS, PDIP32, PLASTIC, DIP-32 | UVPROM, 128KX8, 50ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | UVPROM, 128KX8, 50ns, CMOS, CQCC32, CERAMIC, LCC-32 | UVPROM, 128KX8, 50ns, CMOS, CQCC32, CERAMIC, LCC-32 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | AMD | AMD | AMD | AMD | AMD | AMD |
| Parts packaging code | DIP | QFJ | DIP | DIP | QFJ | QFJ |
| package instruction | WDIP, DIP32,.6 | QCCJ, LDCC32,.5X.6 | DIP, DIP32,.6 | WDIP, DIP32,.6 | WQCCN, LCC32,.45X.55 | WQCCN, LCC32,.45X.55 |
| Contacts | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 50 ns | 60 ns | 60 ns | 50 ns | 50 ns | 50 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-GDIP-T32 | R-PQCC-J32 | R-PDIP-T32 | R-GDIP-T32 | R-CQCC-N32 | R-CQCC-N32 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 42.1005 mm | 13.97 mm | 42.164 mm | 42.1005 mm | 13.97 mm | 13.97 mm |
| memory density | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| Memory IC Type | UVPROM | OTP ROM | OTP ROM | UVPROM | UVPROM | UVPROM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 | 32 | 32 | 32 |
| word count | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| character code | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | WDIP | QCCJ | DIP | WDIP | WQCCN | WQCCN |
| Encapsulate equivalent code | DIP32,.6 | LDCC32,.5X.6 | DIP32,.6 | DIP32,.6 | LCC32,.45X.55 | LCC32,.45X.55 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE, WINDOW | CHIP CARRIER | IN-LINE | IN-LINE, WINDOW | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.588 mm | 3.556 mm | 5.715 mm | 5.588 mm | 3.556 mm | 3.556 mm |
| Maximum standby current | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A | 0.001 A |
| Maximum slew rate | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA |
| Maximum supply voltage (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | YES | NO | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | DUAL | DUAL | QUAD | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 15.24 mm | 11.43 mm | 15.24 mm | 15.24 mm | 11.43 mm | 11.43 mm |
京公网安备 11010802033920号
EEWORLD
