IFX27001
Linear Voltage Regulator
IFX27001TFV15
IFX27001TFV18
IFX27001TFV26
IFX27001TFV33
Data Sheet
Rev. 1.01, 2009-10-19
Standard Power
Linear Voltage Regulator
IFX27001
1
Features
•
•
•
•
•
•
•
•
Overview
1.5V, 1.8V, 2.6V, 3.3 V, 5.0V or Adj. output voltage
1.0 A output current
Low dropout voltage, 1 V (typ.)
Short circuit protection
Overtemperature protection
Input Votlage up to 40 V
Wide temperature range of
T
j
= -40 to 125
°C
Green Product (RoHS compliant)
PG-TO252-3
Applications
•
•
•
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Manufacturing Automation
Appliances
HDTV Televisions
Game Consoles
Network Routers
For automotive and transportation applications, please refer to the Infineon TLE and TLF voltage regulator series
Description
The IFX27001 is a monolithic integrated NPN type voltage regulator that can supply loads up to 1.0 A. The chip
is housed in a surface mount PG-TO252-3 package (DPAK). It is designed to supply microprocessor systems or
other loads under the severe conditions and therefore it is equipped with additional protection against overload,
short circuit and overtemperature.
An large input voltage
V
I
in the range of (
V
Q
+
V
DR
) <
V
I
< 40 V is regulated to
V
Q
. The dropout voltage
V
DR
ranges
from 1.1 V to 1.4 V depending on the load current level.
The device operates in the temperature range of
T
j
= -40 to 125
°C..
Type
IFX27001TFV15
IFX27001TFV18
IFX27001TFV26
IFX27001TFV33
IFX27001TFV50
IFX27001TFV
Data Sheet
Package
PG-TO252-3
PG-TO252-3
PG-TO252-3
PG-TO252-3
PG-TO252-3
PG-TO252-3
2
Marking
2700115
2700118
2700126
2700133
2700150
27001V
Rev. 1.01, 2009-10-19
IFX27001
Block Diagram
2
Block Diagram
I
Q
Control
with
Overtemperature
Protection;
Overcurrent
Protection
Internal
Reference
GND
AES02840
Figure 1
Block Diagram for Fixed Output Voltage (1.5V, 1.8V, 2.6V, 3.3V, 5.0V)
I
Q
Control
with
Overtemperature
Protection;
Overcurrent
Protection
Adjust
Internal
Reference
AES02839
Figure 2
Block Diagram for Adjustable Output Voltage
Data Sheet
3
Rev. 1.01, 2009-10-19
IFX27001
Pin Configuration
3
3.1
Pin Configuration
Pin Assignment
Fixed Output
Voltage Version
Q
Adjustable Output
Voltage Version
Q
1
Q
GND
1
Q
I
AEP02817
ADJ
I
AEP02821
Figure 3
Pin Configuration (top view)
3.2
Table 1
1
2, Tab
3
Table 2
1
2, Tab
Pin Definitions and Functions
Pin Definitions and Functions Fixed Output Voltage Versions
Function
Ground
Output;
Connect a capacitor C
Q
≥
10 µF with ESR
≤
10
Ω
between pin Q and GND
Connect to heatsink area.
Input
Pin Definitions and Functions Adjustable Output Version
Function
Adjust;
defines output voltage by external voltage divider between Q, ADJ and GND.
Output;
the output voltage is defined by the external voltage divider between Q, Adjust and
Ground.
Connect a capacitor C
Q
≥
10 µF with ESR
≤
10
Ω
between pin Q and GND
Connect to heatsink area.
Input
ADJ
Q
GND
Q
I
Pin No. Symbol
Pin No. Symbol
3
I
Data Sheet
4
Rev. 1.01, 2009-10-19
IFX27001
General Product Characteristics
4
4.1
General Product Characteristics
Absolute Maximum Ratings
Absolute Maximum Ratings
1)
T
j
= -40 °C to 150 °C; all voltages with respect to ground, (unless otherwise specified)
Pos.
Input I
4.1.1
4.1.2
Output Q
4.1.3
4.1.4
4.1.5
4.1.6
4.1.7
4.1.8
Voltage
Junction temperature
Storage temperature
ESD Absorption
Voltage
Voltage
Parameter
Symbol
Min.
Limit Values
Max.
40
40
40
150
150
2
500
750
V
V
V
°C
°C
kV
V
V
–
–
–
–
–
Human Body Model
(HBM)
2)
Charge Device
Model (CDM)
3)
Charge Device
Model (CDM)
3)
at
corner pins
Unit
Test Condition
V
I
V
I
- V
Q
V
Q
T
j
T
stg
V
ESD,HBM
V
ESD,CDM
-0.3
-0.3
-0.3
-40
-50
-2
-500
-750
Input - Output Voltage Differential (Applies to Adjustable Output Version Only)I
Temperature
ESD Susceptibility
1) not subject to production test, specified by design
2) ESD susceptibility Human Body Model “HBM” according to AEC-Q100-002 - JESD22-A114
3) ESD susceptibility Charged Device Model “CDM” according to ESDA STM5.3.1
Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
Data Sheet
5
Rev. 1.01, 2009-10-19
Microcontroller MCU
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