AM29C332-1GC datasheet, PDF - EEWORLD Datasheet

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AM29C332-1GC: DescriptionBit-Slice Processor, 32-Bit, CMOS, CPGA169, CERAMIC, PGA-169; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，38 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM29C332-1GC Overview

Bit-Slice Processor, 32-Bit, CMOS, CPGA169, CERAMIC, PGA-169

AM29C332-1GC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	PGA
package instruction	CERAMIC, PGA-169
Contacts	169
Reach Compliance Code	unknow
External data bus width	32
JESD-30 code	S-CPGA-P169
JESD-609 code	e0
length	44.704 mm
Number of terminals	169
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	4.953 mm
Maximum slew rate	70 mA
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED
width	44.704 mm
uPs/uCs/peripheral integrated circuit type	BIT-SLICE MICROPROCESSOR
Base Number Matches	1

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AM29C332-1GC Related Products

	AM29C332-1GC	AM29C332-1GCB	AM29C332GC	AM29C332GCB	AM29C332/BZC
Description	Bit-Slice Processor, 32-Bit, CMOS, CPGA169, CERAMIC, PGA-169	Bit-Slice Processor, 32-Bit, CMOS, CPGA169, CERAMIC, PGA-169	Bit-Slice Processor, 32-Bit, CMOS, CPGA169, CERAMIC, PGA-169	Bit-Slice Processor, 32-Bit, CMOS, CPGA169, CERAMIC, PGA-169	Bit-Slice Processor, 32-Bit, CMOS, CPGA169, CERAMIC, PGA-169
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	PGA	PGA	PGA	PGA	PGA
package instruction	CERAMIC, PGA-169	PGA,	PGA,	PGA,	PGA,
Contacts	169	169	169	169	169
Reach Compliance Code	unknow	unknow	unknow	unknow	unknown
External data bus width	32	32	32	32	32
JESD-30 code	S-CPGA-P169	S-CPGA-P169	S-CPGA-P169	S-CPGA-P169	S-CPGA-P169
JESD-609 code	e0	e0	e0	e0	e0
length	44.704 mm	44.704 mm	44.704 mm	44.704 mm	44.704 mm
Number of terminals	169	169	169	169	169
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	125 °C
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA	PGA	PGA	PGA	PGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.953 mm	4.953 mm	4.953 mm	4.953 mm	4.953 mm
Maximum slew rate	70 mA	70 mA	70 mA	70 mA	70 mA
Maximum supply voltage	5.25 V	5.25 V	5.25 V	5.25 V	5.5 V
Minimum supply voltage	4.75 V	4.75 V	4.75 V	4.75 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	44.704 mm	44.704 mm	44.704 mm	44.704 mm	44.704 mm
uPs/uCs/peripheral integrated circuit type	BIT-SLICE MICROPROCESSOR	BIT-SLICE MICROPROCESSOR	BIT-SLICE MICROPROCESSOR	BIT-SLICE MICROPROCESSOR	BIT-SLICE MICROPROCESSOR
Base Number Matches	1	1	1	1	1

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