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HSDL-5420

Description
PIN Photodiode, PLASTIC, SMT, 2 PIN
CategoryLED optoelectronic/LED    photoelectric   
File Size512KB,19 Pages
ManufacturerBroadcom
Environmental Compliance
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HSDL-5420 Overview

PIN Photodiode, PLASTIC, SMT, 2 PIN

HSDL-5420 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerBroadcom
package instructionPLASTIC, SMT, 2 PIN
Reach Compliance Codecompliant
ECCN codeEAR99
ConfigurationSINGLE
Maximum dark power5 nA
Infrared rangeYES
JESD-609 codee3
Nominal photocurrent0.0043 mA
Number of functions1
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Optoelectronic device typesPIN PHOTODIODE
peak wavelength875 nm
Minimum reverse breakdown voltage40 V
shapeROUND
size1.78 mm
Terminal surfaceMatte Tin (Sn)
HSDL-44xx IR Emitter Series
HSDL-54xx IR Detector Series
High-Performance IR Emitter and IR PIN Photodiode in
Subminiature SMT Package
Data Sheet
Description
Flat Top Package
The HSDL-4400 Series of flat top IR emitters uses an
untinted, nondiffused, truncated lens to provide a
wide radiation pattern that is useful for short distance
communication where alignment of the emitter and
detector is not critical. The HSDL-5400 Series of flat
top IR detectors uses the same truncated lens design
as the HSDL-4400 Series of IR emitters with the
added feature of a black tint that acts as an optical
filter to reduce the effects of ambient light, such as
sun, incandescent and fluorescent light from
interfering with the IR signal.
Dome Package
The HSDL-4420 Series of dome IR emitters uses an
untinted, nondiffused lens to provide a 24 degree
viewing angle with high on-axis intensity. The
HSDL-5420 Series of IR detectors uses the same lens
design as the HSDL-4420 IR emitter and optical filter
used in the HSDL-5400 IR detector.
Lead Configuration
All of these devices are made by encapsulating LED
and PIN photodiode chips on axial lead frames to
form molded epoxy subminiature packages. A variety
of lead configurations is available and includes:
surface mount gull wing, yoke lead, or Z-bend and
through hole lead bends at 2.54 mm (0.100 inch)
center spacing.
Technology
The subminiature solid state emitters utilize a highly
optimized LED material, transparent substrate
aluminum gallium arsenide, TS AlGaAs. This material
has a very high radiant efficiency, capable of pro-
ducing high light output over a wide range of drive
currents and temperature.
Features
• Subminiature flat top and dome package
Size – 2x2 mm
• IR emitter
875 nm TS AlGaAs
Intensity – 17 mW/sr
Speed – 40 ns
• Wide range of drive currents
500
µA
to 500 mA
• IR detector
PIN photodiode
High sensitivity
Speed – 7.5 ns
• Flexible lead configurations
Surface mount or through hole
Applications
• Short distance IR links
• IrDA compatible
• Small handheld devices
Pagers
Industrial handhelds
• Diffuse LANs
• Wireless audio
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