AM27S27DCB datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > storage> storage> AM27S27DCB

AM27S27DCB: DescriptionOTP ROM, 512X8, 27ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22; Categorystorage storage; File Size206KB，8 Pages; ManufacturerAMD; Websitehttp://www.amd.com

Download Datasheet Parametric Compare View All

AM27S27DCB Overview

OTP ROM, 512X8, 27ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22

AM27S27DCB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	AMD
Parts packaging code	DIP
package instruction	DIP, DIP22,.4
Contacts	22
Reach Compliance Code	unknow
ECCN code	EAR99
Maximum access time	27 ns
JESD-30 code	R-GDIP-T22
JESD-609 code	e0
length	27.4955 mm
memory density	4096 bi
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	22
word count	512 words
character code	512
Operating mode	SYNCHRONOUS
Maximum operating temperature	75 °C
Minimum operating temperature
organize	512X8
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP22,.4
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Certification status	Not Qualified
Maximum seat height	5.588 mm
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BIPOLAR
Temperature level	COMMERCIAL EXTENDED
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	10.16 mm
Base Number Matches	1

Preview

Download Datasheet

View All

AM27S27DCB Related Products

	AM27S27DCB	AM27S27ADC	AM27S27ADCB	AM27S27/BKA	AM27S27/DMC	AM27S27A/BWA	AM27S27A/DMC	AM27S27A/BKA	AM27S27/BWA
Description	OTP ROM, 512X8, 27ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22	OTP ROM, 512X8, 17ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22	OTP ROM, 512X8, 17ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22	OTP ROM, 512X8, 30ns, Bipolar, CDFP24, FP-24	OTP ROM, 512X8, 30ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22	OTP ROM, 512X8, 20ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22	OTP ROM, 512X8, 20ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22	OTP ROM, 512X8, 20ns, Bipolar, CDFP24, FP-24	OTP ROM, 512X8, 30ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22
Parts packaging code	DIP	DIP	DIP	DFP	DIP	DIP	DIP	DFP	DIP
package instruction	DIP, DIP22,.4	DIP, DIP22,.4	DIP, DIP22,.4	DFP, FL24,.4	DIP, DIP22,.4	DIP, DIP22,.4	DIP, DIP22,.4	DFP,	DIP, DIP22,.4
Contacts	22	22	22	24	22	22	22	24	22
Reach Compliance Code	unknow	unknow	unknow	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	27 ns	17 ns	17 ns	30 ns	30 ns	20 ns	20 ns	20 ns	30 ns
JESD-30 code	R-GDIP-T22	R-GDIP-T22	R-GDIP-T22	R-GDFP-F24	R-GDIP-T22	R-GDIP-T22	R-GDIP-T22	R-GDFP-F24	R-GDIP-T22
length	27.4955 mm	27.4955 mm	27.4955 mm	15.367 mm	27.4955 mm	27.4955 mm	27.4955 mm	15.367 mm	27.4955 mm
memory density	4096 bi	4096 bi	4096 bi	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit	4096 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	22	22	22	24	22	22	22	24	22
word count	512 words	512 words	512 words	512 words	512 words	512 words	512 words	512 words	512 words
character code	512	512	512	512	512	512	512	512	512
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	75 °C	75 °C	75 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-	-	-	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	512X8	512X8	512X8	512X8	512X8	512X8	512X8	512X8	512X8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DIP	DIP	DFP	DIP	DIP	DIP	DFP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	FLATPACK	IN-LINE	IN-LINE	IN-LINE	FLATPACK	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.588 mm	5.588 mm	5.588 mm	2.286 mm	5.588 mm	5.588 mm	5.588 mm	2.286 mm	5.588 mm
Maximum supply voltage (Vsup)	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V	5.5 V	5.25 V
Minimum supply voltage (Vsup)	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V	4.5 V	4.75 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	YES	NO	NO	NO	YES	NO
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	FLAT	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
width	10.16 mm	10.16 mm	10.16 mm	9.525 mm	10.16 mm	10.16 mm	10.16 mm	9.525 mm	10.16 mm
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	-	incompatible
Maker	AMD	-	AMD	AMD	AMD	AMD	AMD	AMD	AMD
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	-	e0
Encapsulate equivalent code	DIP22,.4	DIP22,.4	DIP22,.4	FL24,.4	DIP22,.4	DIP22,.4	DIP22,.4	-	DIP22,.4
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)
Filter level	-	-	-	38535Q/M;38534H;883B	MIL-STD-883 Class B (Modified)	38535Q/M;38534H;883B	MIL-STD-883 Class B (Modified)	-	38535Q/M;38534H;883B

Recommended Resources

Grain moisture analysis circuit

Auto-coupling fully automatic voltage regulator circuit diagram

Electronic thermostatic control circuit

Double interlocking motor forward and reverse control circuit

Low voltage drop, high current voltage stabilizing circuit

Induction electric heating automatic control circuit

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components