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AM27S27A/BKA

Description
OTP ROM, 512X8, 20ns, Bipolar, CDFP24, FP-24
Categorystorage    storage   
File Size206KB,8 Pages
ManufacturerAMD
Websitehttp://www.amd.com
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AM27S27A/BKA Overview

OTP ROM, 512X8, 20ns, Bipolar, CDFP24, FP-24

AM27S27A/BKA Parametric

Parameter NameAttribute value
MakerAMD
Parts packaging codeDFP
package instructionDFP,
Contacts24
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time20 ns
JESD-30 codeR-GDFP-F24
length15.367 mm
memory density4096 bit
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals24
word count512 words
character code512
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512X8
Output characteristics3-STATE
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDFP
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
Certification statusNot Qualified
Maximum seat height2.286 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyBIPOLAR
Temperature levelMILITARY
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
width9.525 mm

AM27S27A/BKA Related Products

AM27S27A/BKA AM27S27ADC AM27S27ADCB AM27S27DCB AM27S27/BKA AM27S27/DMC AM27S27A/BWA AM27S27A/DMC AM27S27/BWA
Description OTP ROM, 512X8, 20ns, Bipolar, CDFP24, FP-24 OTP ROM, 512X8, 17ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22 OTP ROM, 512X8, 17ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22 OTP ROM, 512X8, 27ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22 OTP ROM, 512X8, 30ns, Bipolar, CDFP24, FP-24 OTP ROM, 512X8, 30ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22 OTP ROM, 512X8, 20ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22 OTP ROM, 512X8, 20ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22 OTP ROM, 512X8, 30ns, Bipolar, CDIP22, 0.400 INCH, CERAMIC, DIP-22
Parts packaging code DFP DIP DIP DIP DFP DIP DIP DIP DIP
package instruction DFP, DIP, DIP22,.4 DIP, DIP22,.4 DIP, DIP22,.4 DFP, FL24,.4 DIP, DIP22,.4 DIP, DIP22,.4 DIP, DIP22,.4 DIP, DIP22,.4
Contacts 24 22 22 22 24 22 22 22 22
Reach Compliance Code unknown unknow unknow unknow unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 20 ns 17 ns 17 ns 27 ns 30 ns 30 ns 20 ns 20 ns 30 ns
JESD-30 code R-GDFP-F24 R-GDIP-T22 R-GDIP-T22 R-GDIP-T22 R-GDFP-F24 R-GDIP-T22 R-GDIP-T22 R-GDIP-T22 R-GDIP-T22
length 15.367 mm 27.4955 mm 27.4955 mm 27.4955 mm 15.367 mm 27.4955 mm 27.4955 mm 27.4955 mm 27.4955 mm
memory density 4096 bit 4096 bi 4096 bi 4096 bi 4096 bit 4096 bit 4096 bit 4096 bit 4096 bit
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM OTP ROM
memory width 8 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1 1
Number of terminals 24 22 22 22 24 22 22 22 22
word count 512 words 512 words 512 words 512 words 512 words 512 words 512 words 512 words 512 words
character code 512 512 512 512 512 512 512 512 512
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 125 °C 75 °C 75 °C 75 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C - - - -55 °C -55 °C -55 °C -55 °C -55 °C
organize 512X8 512X8 512X8 512X8 512X8 512X8 512X8 512X8 512X8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
encapsulated code DFP DIP DIP DIP DFP DIP DIP DIP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form FLATPACK IN-LINE IN-LINE IN-LINE FLATPACK IN-LINE IN-LINE IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.286 mm 5.588 mm 5.588 mm 5.588 mm 2.286 mm 5.588 mm 5.588 mm 5.588 mm 5.588 mm
Maximum supply voltage (Vsup) 5.5 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V
Minimum supply voltage (Vsup) 4.5 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO NO NO YES NO NO NO NO
technology BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR BIPOLAR
Temperature level MILITARY COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal form FLAT THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE FLAT THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
width 9.525 mm 10.16 mm 10.16 mm 10.16 mm 9.525 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm
Maker AMD - AMD AMD AMD AMD AMD AMD AMD
Is it Rohs certified? - incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
JESD-609 code - e0 e0 e0 e0 e0 e0 e0 e0
Encapsulate equivalent code - DIP22,.4 DIP22,.4 DIP22,.4 FL24,.4 DIP22,.4 DIP22,.4 DIP22,.4 DIP22,.4
Terminal surface - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Filter level - - - - 38535Q/M;38534H;883B MIL-STD-883 Class B (Modified) 38535Q/M;38534H;883B MIL-STD-883 Class B (Modified) 38535Q/M;38534H;883B
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