AM25LS22PCB datasheet, PDF - EEWORLD Datasheet

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AM25LS22PCB: DescriptionShift Register, 8-Bit, TTL, PDIP20; Categorylogic logic; File Size375KB，7 Pages; ManufacturerAMD; Websitehttp://www.amd.com

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AM25LS22PCB Overview

Shift Register, 8-Bit, TTL, PDIP20

AM25LS22PCB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	AMD
package instruction	DIP, DIP20,.3
Reach Compliance Code	unknow
JESD-30 code	R-PDIP-T20
JESD-609 code	e0
Maximum Frequency@Nom-Su	26000000 Hz
Number of digits	8
Number of functions	1
Number of terminals	20
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP20,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Base Number Matches	1

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AM25LS22PCB Related Products

	AM25LS22PCB	AM25LS22PCT	AM25LS22PCTB	AM25LS22DCB	AM25LS22DCTB	AM25LS22DCT	5962-01-123-7449
Description	Shift Register, 8-Bit, TTL, PDIP20	Shift Register, 8-Bit, TTL, PDIP20	Shift Register, 8-Bit, TTL, PDIP20	Shift Register, 8-Bit, TTL, CDIP20	Shift Register, 8-Bit, TTL, CDIP20	Shift Register, 8-Bit, TTL, CDIP20	Shift Register, 8-Bit, TTL, CDIP20
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3	DIP, DIP20,.3
Reach Compliance Code	unknow	unknow	unknow	unknown	unknown	unknown	compli
JESD-30 code	R-PDIP-T20	R-PDIP-T20	R-PDIP-T20	R-XDIP-T20	R-XDIP-T20	R-XDIP-T20	R-XDIP-T20
Number of digits	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1
Number of terminals	20	20	20	20	20	20	20
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	125 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DIP	DIP	DIP	DIP	DIP	DIP	DIP
Encapsulate equivalent code	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3	DIP20,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO	NO
technology	TTL	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maker	AMD	-	-	AMD	AMD	AMD	AMD
JESD-609 code	e0	e0	e0	e0	e0	e0	-
Maximum Frequency@Nom-Su	26000000 Hz	26000000 Hz	26000000 Hz	-	-	-	23000000 Hz
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-

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