Shift Register, 8-Bit, TTL, CDIP20
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| package instruction | DIP, DIP20,.3 |
| Reach Compliance Code | compli |
| JESD-30 code | R-XDIP-T20 |
| Maximum Frequency@Nom-Su | 23000000 Hz |
| Number of digits | 8 |
| Number of functions | 1 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP20,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class B (Modified) |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| 5962-01-123-7449 | AM25LS22PCB | AM25LS22PCT | AM25LS22PCTB | AM25LS22DCB | AM25LS22DCTB | AM25LS22DCT | |
|---|---|---|---|---|---|---|---|
| Description | Shift Register, 8-Bit, TTL, CDIP20 | Shift Register, 8-Bit, TTL, PDIP20 | Shift Register, 8-Bit, TTL, PDIP20 | Shift Register, 8-Bit, TTL, PDIP20 | Shift Register, 8-Bit, TTL, CDIP20 | Shift Register, 8-Bit, TTL, CDIP20 | Shift Register, 8-Bit, TTL, CDIP20 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 |
| Reach Compliance Code | compli | unknow | unknow | unknow | unknown | unknown | unknown |
| JESD-30 code | R-XDIP-T20 | R-PDIP-T20 | R-PDIP-T20 | R-PDIP-T20 | R-XDIP-T20 | R-XDIP-T20 | R-XDIP-T20 |
| Number of digits | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO | NO |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | AMD | AMD | - | - | AMD | AMD | AMD |
| Maximum Frequency@Nom-Su | 23000000 Hz | 26000000 Hz | 26000000 Hz | 26000000 Hz | - | - | - |
| JESD-609 code | - | e0 | e0 | e0 | e0 | e0 | e0 |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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