Multi-Port SRAM, 4KX9, 25ns, BICMOS, CQCC68, FINE PITCH, LCC-68
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | LCC |
| package instruction | FINE PITCH, LCC-68 |
| Contacts | 68 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum access time | 25 ns |
| I/O type | COMMON |
| JESD-30 code | S-CQCC-N68 |
| JESD-609 code | e0 |
| length | 14.224 mm |
| memory density | 36864 bit |
| Memory IC Type | MULTI-PORT SRAM |
| memory width | 9 |
| Number of functions | 1 |
| Number of ports | 2 |
| Number of terminals | 68 |
| word count | 4096 words |
| character code | 4000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 4KX9 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC68,.56SQ,25 |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 3.048 mm |
| Maximum slew rate | 0.24 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | BICMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 0.635 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 14.224 mm |
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