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PTFB191501F

Description
Thermally-Enhanced High Power RF LDMOS FETs 150 W, 1930 鈥?1990 MHz
File Size278KB,15 Pages
ManufacturerInfineon
Websitehttp://www.infineon.com/
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PTFB191501F Overview

Thermally-Enhanced High Power RF LDMOS FETs 150 W, 1930 鈥?1990 MHz

PTFB191501E
PTFB191501F
Confidential, Limited Internal Distribution
Thermally-Enhanced High Power RF LDMOS FETs
150 W, 1930 – 1990 MHz
Description
The PTFB191501E and PTFB191501F are 150-watt LDMOS FETs
designed for single- and two-carrier WCDMA and CDMA applications
from 1930 to 1990 MHz. Features include input and output matching,
and thermally-enhanced, RoHs-compliant package with slotted and
earless flanges. Manufactured with Infineon's advanced LDMOS
process, these devices provide excellent thermal performance and
superior reliability.
PTFB191501E
Package H-36248-2
PTFB191501F
Package H-37248-2
Two-carrier WCDMA Drive-up
V
DD
= 30 V, I
DQ
= 1.20 A, ƒ = 1990 MHz, 3GPP WCDMA,
PAR = 8 dB, 10 MHz carrier spacing, BW 3.84 MHz
-20
-25
-30
40
Features
Broadband internal matching
Typical two-carrier WCDMA performance at
1990 MHz, 30 V
- Average output power = 35 W
- Linear gain = 18 dB
- Efficiency = 30%
- Intermodulation distortion = –35 dBc
Typical CW performance, 1990 MHz, 30 V
- Output power at P–1dB = 150 W
- Efficiency = 55%
Increased negative gate-source voltage range for
improved performance in Doherty peaking
amplifiers
Integrated ESD protection: Human Body Model,
Class 2 (minimum)
Excellent thermal stability, low HCI drift
Capable of handling 10:1 VSWR @ 30 V, 150 W
(CW) output power
Pb-free, RoHS-compliant
Efficiency
IMD Up
35
30
Efficiency (%)
IMD (dBc)
-35
-40
-45
-50
-55
-60
31
33
35
37
39
41
43
45
47
49
25
20
15
IMD Low
ACPR
10
5
0
Output Power (dBm)
RF Characteristics
Two-carrier WCDMA Measurements
(not subject to production test—verified by design/characterization in Infineon test fixture)
V
DD
= 30 V, I
DQ
= 1.2 A, P
OUT
= 35 W average, ƒ
1
= 1985 MHz, ƒ
2
= 1995 MHz, 3GPP signal, channel bandwidth = 3.84 MHz,
peak/average = 8 dB @ 0.01% CCDF
Characteristic
Gain
Drain Efficiency
Intermodulation Distortion
All published data at T
CASE
= 25°C unless otherwise indicated
Symbol
G
ps
Min
Typ
18
30
–35
Max
Unit
dB
%
dBc
η
D
IMD
*See Infineon distributor for future availability.
ESD:
Electrostatic discharge sensitive device—observe handling precautions!
Data Sheet
1 of 15
Rev. 02, 2009-09-09

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Description Thermally-Enhanced High Power RF LDMOS FETs 150 W, 1930 鈥?1990 MHz Thermally-Enhanced High Power RF LDMOS FETs 150 W, 1930 鈥?1990 MHz
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