OT PLD, 6ns, PAL-Type, ECL, CDIP24, 0.300 INCH, SLIM, HERMETIC SEALED, CERAMIC, DIP-24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| Parts packaging code | DIP |
| package instruction | DIP, DIP24,.3 |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| Architecture | PAL-TYPE |
| maximum clock frequency | 125 MHz |
| JESD-30 code | R-GDIP-T24 |
| JESD-609 code | e0 |
| Dedicated input times | 11 |
| Number of I/O lines | 8 |
| Number of entries | 20 |
| Output times | 8 |
| Number of product terms | 90 |
| Number of terminals | 24 |
| Maximum operating temperature | 75 °C |
| Minimum operating temperature | |
| organize | 11 DEDICATED INPUTS, 8 I/O |
| Output function | MACROCELL |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | -5.2 V |
| Programmable logic type | OT PLD |
| propagation delay | 6 ns |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | ECL |
| Temperature level | COMMERCIAL EXTENDED |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
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