IC,LINE RECEIVER,DUAL,BIPOLAR,DIFFERENTIAL,FP,14PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DFP, FL14,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-XDFP-F14 |
| JESD-609 code | e0 |
| Nominal negative supply voltage | -5 V |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Maximum output low current | 0.016 A |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL14,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | +-5 V |
| Certification status | Not Qualified |
| Maximum receive delay | 25 ns |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | BIPOLAR |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| DS1603W | DS1603W/883C | DS1603W/883B | DS1603J/883C | DS1603J/883B | |
|---|---|---|---|---|---|
| Description | IC,LINE RECEIVER,DUAL,BIPOLAR,DIFFERENTIAL,FP,14PIN,CERAMIC | IC,LINE RECEIVER,DUAL,BIPOLAR,DIFFERENTIAL,FP,14PIN,CERAMIC | IC,LINE RECEIVER,DUAL,BIPOLAR,DIFFERENTIAL,FP,14PIN,CERAMIC | IC,LINE RECEIVER,DUAL,BIPOLAR,DIFFERENTIAL,DIP,14PIN,CERAMIC | IC,LINE RECEIVER,DUAL,BIPOLAR,DIFFERENTIAL,DIP,14PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DFP, FL14,.3 | DFP, FL14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-XDFP-F14 | R-XDFP-F14 | R-XDFP-F14 | R-XDIP-T14 | R-XDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| Nominal negative supply voltage | -5 V | -5 V | -5 V | -5 V | -5 V |
| Number of terminals | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| Maximum output low current | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DFP | DFP | DFP | DIP | DIP |
| Encapsulate equivalent code | FL14,.3 | FL14,.3 | FL14,.3 | DIP14,.3 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | FLATPACK | FLATPACK | IN-LINE | IN-LINE |
| power supply | +-5 V | +-5 V | +-5 V | +-5 V | +-5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum receive delay | 25 ns | 25 ns | 25 ns | 25 ns | 25 ns |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | NO | NO |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | Texas Instruments | - | - | Texas Instruments | Texas Instruments |
| Filter level | - | MIL-STD-883 Class C | 38535Q/M;38534H;883B | MIL-STD-883 Class C | 38535Q/M;38534H;883B |