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Datasheet> All Categories > storage> storage> IDT7MC4032S30CV
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IDT7MC4032S30CV

Description
SRAM Module, 16KX32, 30ns, CMOS
Categorystorage    storage   
File Size179KB，7 Pages
ManufacturerIDT (Integrated Device Technology)
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IDT7MC4032S30CV Overview

SRAM Module, 16KX32, 30ns, CMOS

IDT7MC4032S30CV Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time30 ns
I/O typeSEPARATE
JESD-30 codeR-XDMA-T88
JESD-609 codee0
memory density524288 bit
Memory IC TypeSRAM MODULE
memory width32
Number of functions1
Number of terminals88
word count16384 words
character code16000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize16KX32
Output characteristics3-STATE
Package body materialUNSPECIFIED
encapsulated codeDIP
Encapsulate equivalent codeDIP88,.1
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum standby current0.12 A
Minimum standby current4.5 V
Maximum slew rate1 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED

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IDT7MC4032S30CV Related Products

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Description SRAM Module, 16KX32, 30ns, CMOS SRAM Module, 16KX32, 25ns, CMOS SRAM Module, 16KX32, 25ns, CMOS SRAM Module, 16KX32, 40ns, CMOS SRAM Module, 16KX32, 40ns, CMOS SRAM Module, 16KX32, 30ns, CMOS SRAM Module, 16KX32, 50ns, CMOS SRAM Module, 16KX32, 50ns, CMOS SRAM Module, 16KX32, 20ns, CMOS SRAM Module, 16KX32, 70ns, CMOS
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 3A001.A.2.C EAR99 3A001.A.2.C 3A001.A.2.C EAR99 3A001.A.2.C 3A991.B.2.B 3A001.A.2.C
Maximum access time 30 ns 25 ns 25 ns 40 ns 40 ns 30 ns 50 ns 50 ns 20 ns 70 ns
I/O type SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE
JESD-30 code R-XDMA-T88 R-XDMA-T88 R-XDMA-T88 R-XDMA-T88 R-XDMA-T88 R-XDMA-T88 R-XDMA-T88 R-XDMA-T88 R-XDMA-T88 R-XDMA-T88
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
memory density 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit
Memory IC Type SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE SRAM MODULE
memory width 32 32 32 32 32 32 32 32 32 32
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 88 88 88 88 88 88 88 88 88 88
word count 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words 16384 words
character code 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 125 °C 70 °C 125 °C 125 °C 70 °C 125 °C 70 °C 125 °C
organize 16KX32 16KX32 16KX32 16KX32 16KX32 16KX32 16KX32 16KX32 16KX32 16KX32
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code DIP DIP DIP DIP DIP DIP DIP DIP DIP DIP
Encapsulate equivalent code DIP88,.1 DIP88,.1 DIP88,.1 DIP88,.1 DIP88,.1 DIP88,.1 DIP88,.1 DIP88,.1 DIP88,.1 DIP88,.1
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 225 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum standby current 0.12 A 0.16 A 0.16 A 0.12 A 0.16 A 0.16 A 0.12 A 0.16 A 0.16 A 0.16 A
Minimum standby current 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Maximum slew rate 1 mA 1.2 mA 1.2 mA 1 mA 1.12 mA 1.12 mA 1 mA 1.12 mA 1.2 mA 1.12 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO NO NO NO NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL MILITARY COMMERCIAL MILITARY MILITARY COMMERCIAL MILITARY COMMERCIAL MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED

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