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IDT7MC4001S45CS

Description
SRAM Module, 1MX1, 45ns, CMOS
Categorystorage    storage   
File Size138KB,6 Pages
ManufacturerIDT (Integrated Device Technology)
Download Datasheet Parametric Compare View All

IDT7MC4001S45CS Overview

SRAM Module, 1MX1, 45ns, CMOS

IDT7MC4001S45CS Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIDT (Integrated Device Technology)
Reach Compliance Codenot_compliant
ECCN codeEAR99
Maximum access time45 ns
I/O typeSEPARATE
JESD-30 codeR-XSMA-T30
JESD-609 codee0
memory density1048576 bit
Memory IC TypeSRAM MODULE
memory width1
Number of functions1
Number of terminals30
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX1
Output characteristics3-STATE
Package body materialUNSPECIFIED
Encapsulate equivalent codeSIP30,.2
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Parallel/SerialSERIAL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Maximum standby current0.06 A
Minimum standby current4.5 V
Maximum slew rate0.245 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED

IDT7MC4001S45CS Related Products

IDT7MC4001S45CS IDT7MC4001S35CS IDT7MC4001S55CS
Description SRAM Module, 1MX1, 45ns, CMOS SRAM Module, 1MX1, 35ns, CMOS SRAM Module, 1MX1, 55ns, CMOS
Is it Rohs certified? incompatible incompatible incompatible
Reach Compliance Code not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99
Maximum access time 45 ns 35 ns 55 ns
I/O type SEPARATE SEPARATE SEPARATE
JESD-30 code R-XSMA-T30 R-XSMA-T30 R-XSMA-T30
JESD-609 code e0 e0 e0
memory density 1048576 bit 1048576 bit 1048576 bit
Memory IC Type SRAM MODULE SRAM MODULE SRAM MODULE
memory width 1 1 1
Number of functions 1 1 1
Number of terminals 30 30 30
word count 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C
organize 1MX1 1MX1 1MX1
Output characteristics 3-STATE 3-STATE 3-STATE
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED
Encapsulate equivalent code SIP30,.2 SIP30,.2 SIP30,.2
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial SERIAL SERIAL SERIAL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum standby current 0.06 A 0.06 A 0.06 A
Minimum standby current 4.5 V 4.5 V 4.5 V
Maximum slew rate 0.245 mA 0.245 mA 0.245 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V
surface mount NO NO NO
technology CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm
Terminal location SINGLE SINGLE SINGLE
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Base Number Matches - 1 1
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