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82562EP

Description
82562EP 10/100 Mbps Platform LAN Connect (PLC)
CategoryWireless rf/communication    Telecom circuit   
File Size232KB,24 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Download Datasheet Parametric Compare View All

82562EP Overview

82562EP 10/100 Mbps Platform LAN Connect (PLC)

82562EP Parametric

Parameter NameAttribute value
MakerIntel
Parts packaging codeBGA
package instructionPLASTIC, BGA-64
Contacts64
Reach Compliance Codecompli
Is SamacsysN
JESD-30 codeS-PBGA-B64
length8 mm
Number of functions1
Number of terminals64
Maximum operating temperature85 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeSQUARE
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Certification statusNot Qualified
Maximum seat height1.2 mm
Nominal supply voltage3.3 V
surface mountYES
Telecom integrated circuit typesINTERFACE CIRCUIT
Temperature levelOTHER
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
width8 mm
Base Number Matches1
82562EP 10/100 Mbps Platform LAN
Connect (PLC)
Networking Silicon
Datasheet
Product Features
IEEE 802.3 10BASE-T/100BASE-TX
compliant physical layer interface
IEEE 802.3u Auto-Negotiation support
Digital Adaptive Equalization control
Link status interrupt capability
XOR tree mode support
3-port LED support (speed, link and
activity)
10BASE-T auto-polarity correction
Alert on LAN functionality
Diagnostic loopback mode
1:1 transmit transformer ratio support
Low power (less than 300 mW in active
transmit mode)
Reduced power in “unplugged mode” (less
than 50 mW)
Automatic detection of “unplugged mode”
3.3 V device
Lead-free
1
64-pin Plastic Ball Grid Array
Package for both leaded and lead-free
designs. (Devices that are lead-free are
marked with a circled “e1” and have the
product code prefix: PCxxxxxx).
This device is lead-free. That is, lead has not been intentionally added, but lead may still exist
as an impurity at <1000 ppm. The Material Declaration Data Sheet, which includes lead
impurity levels and the concentration of other Restriction on Hazardous Substances (RoHS)-
banned materials, is available at:
ftp://download.intel.com/design/packtech/material_content_IC_Package.pdf#pagemode=bookmarks
1
In addition, this device has been tested and conforms to the same parametric specifications as
previous versions of the device.
For more information regarding lead-free products from Intel Corporation, contact your Intel
Field Sales representative.
Revision 2.0
September 2005

82562EP Related Products

82562EP PC82562EP RC82562EP
Description 82562EP 10/100 Mbps Platform LAN Connect (PLC) 82562EP 10/100 Mbps Platform LAN Connect (PLC) 82562EP 10/100 Mbps Platform LAN Connect (PLC)
Maker Intel Intel Intel
Reach Compliance Code compli unknow compli
Is Samacsys N N N
JESD-30 code S-PBGA-B64 S-PBGA-B64 S-PBGA-B64
Number of terminals 64 64 64
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA FBGA FBGA
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Certification status Not Qualified Not Qualified Not Qualified
Nominal supply voltage 3.3 V 3.3 V 3.3 V
surface mount YES YES YES
Terminal form BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM
Base Number Matches 1 1 1
Parts packaging code BGA BGA -
package instruction PLASTIC, BGA-64 - FBGA, BGA64,8X8,32
Is it Rohs certified? - conform to incompatible
Encapsulate equivalent code - BGA64,8X8,32 BGA64,8X8,32
power supply - 3.3 V 3.3 V
uPs/uCs/peripheral integrated circuit type - SERIAL IO/COMMUNICATION CONTROLLER, LAN SERIAL IO/COMMUNICATION CONTROLLER, LAN

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