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RC82562EP

Description
82562EP 10/100 Mbps Platform LAN Connect (PLC)
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size232KB,24 Pages
ManufacturerIntel
Websitehttp://www.intel.com/
Download Datasheet Parametric Compare View All

RC82562EP Overview

82562EP 10/100 Mbps Platform LAN Connect (PLC)

RC82562EP Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerIntel
package instructionFBGA, BGA64,8X8,32
Reach Compliance Codecompli
Is SamacsysN
JESD-30 codeS-PBGA-B64
JESD-609 codee0
Number of terminals64
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA64,8X8,32
Package shapeSQUARE
Package formGRID ARRAY, FINE PITCH
power supply3.3 V
Certification statusNot Qualified
Nominal supply voltage3.3 V
surface mountYES
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
uPs/uCs/peripheral integrated circuit typeSERIAL IO/COMMUNICATION CONTROLLER, LAN
Base Number Matches1
82562EP 10/100 Mbps Platform LAN
Connect (PLC)
Networking Silicon
Datasheet
Product Features
IEEE 802.3 10BASE-T/100BASE-TX
compliant physical layer interface
IEEE 802.3u Auto-Negotiation support
Digital Adaptive Equalization control
Link status interrupt capability
XOR tree mode support
3-port LED support (speed, link and
activity)
10BASE-T auto-polarity correction
Alert on LAN functionality
Diagnostic loopback mode
1:1 transmit transformer ratio support
Low power (less than 300 mW in active
transmit mode)
Reduced power in “unplugged mode” (less
than 50 mW)
Automatic detection of “unplugged mode”
3.3 V device
Lead-free
1
64-pin Plastic Ball Grid Array
Package for both leaded and lead-free
designs. (Devices that are lead-free are
marked with a circled “e1” and have the
product code prefix: PCxxxxxx).
This device is lead-free. That is, lead has not been intentionally added, but lead may still exist
as an impurity at <1000 ppm. The Material Declaration Data Sheet, which includes lead
impurity levels and the concentration of other Restriction on Hazardous Substances (RoHS)-
banned materials, is available at:
ftp://download.intel.com/design/packtech/material_content_IC_Package.pdf#pagemode=bookmarks
1
In addition, this device has been tested and conforms to the same parametric specifications as
previous versions of the device.
For more information regarding lead-free products from Intel Corporation, contact your Intel
Field Sales representative.
Revision 2.0
September 2005

RC82562EP Related Products

RC82562EP 82562EP PC82562EP
Description 82562EP 10/100 Mbps Platform LAN Connect (PLC) 82562EP 10/100 Mbps Platform LAN Connect (PLC) 82562EP 10/100 Mbps Platform LAN Connect (PLC)
Maker Intel Intel Intel
Reach Compliance Code compli compli unknow
Is Samacsys N N N
JESD-30 code S-PBGA-B64 S-PBGA-B64 S-PBGA-B64
Number of terminals 64 64 64
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code FBGA TFBGA FBGA
Package shape SQUARE SQUARE SQUARE
Package form GRID ARRAY, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Certification status Not Qualified Not Qualified Not Qualified
Nominal supply voltage 3.3 V 3.3 V 3.3 V
surface mount YES YES YES
Terminal form BALL BALL BALL
Terminal pitch 0.8 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM BOTTOM
Base Number Matches 1 1 1
Is it Rohs certified? incompatible - conform to
package instruction FBGA, BGA64,8X8,32 PLASTIC, BGA-64 -
Encapsulate equivalent code BGA64,8X8,32 - BGA64,8X8,32
power supply 3.3 V - 3.3 V
uPs/uCs/peripheral integrated circuit type SERIAL IO/COMMUNICATION CONTROLLER, LAN - SERIAL IO/COMMUNICATION CONTROLLER, LAN
Parts packaging code - BGA BGA
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