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LSPAD50(TO-72)

Description
Rectifier Diode,
CategoryDiscrete semiconductor    diode   
File Size260KB,1 Pages
ManufacturerMicross
Websitehttps://www.micross.com
Download Datasheet Parametric View All

LSPAD50(TO-72) Overview

Rectifier Diode,

LSPAD50(TO-72) Parametric

Parameter NameAttribute value
MakerMicross
Reach Compliance Codecompliant
ECCN codeEAR99
LSPAD50
LOW LEAKAGE
PICO-AMP DIODE
Linear Systems replaces discontinued Siliconix PAD50
LSPAD50 is a low leakage Pico-Amp Diode packaged in hermetic
TO-72
The LSPAD50 extremely low-leakage diode provides a
superior alternative to conventional diode
technology when reverse current (leakage) must be
minimized. The LSPAD50 features a leakage current of
-50 pA and is well suited for use in applications such as
input protection for operational amplifiers.
FEATURES 
DIRECT REPLACEMENT FOR SILICONIX PAD50 
REVERSE BREAKDOWN VOLTAGE 
ULTRALOW LEAKAGE 
REVERSE CAPACITANCE 
ABSOLUTE MAXIMUM RATINGS  
@ 25°C (unless otherwise noted) 
Maximum Temperatures 
Storage Temperature 
Operating Junction Temperature 
Maximum Power Dissipation 
Continuous Power Dissipation  
MAXIMUM CURRENT
Forward Current (Note 1) 
 
BV
R
≥ ‐45V 
≤ 50 pA 
C
rss
 ≤ 2.0pF 
LSPAD50 Benefits:
Negligible Circuit Leakage Contribution
Circuit “Transparent” Except to Shunt
High-Frequency Spikes
Simplicity of Operation
‐65°C to +150°C 
‐55°C to +135°C 
300mW 
50mA 
LSPAD50 Applications:
Op Amp Input Protection
Multiplexer Overvoltage Protection
 
LSPAD50 ELECTRICAL CHARACTERISTICS @ 25°C (unless otherwise noted)
SYMBOL 
CHARACTERISTICS 
MIN. 
TYP. 
BV
R
 
Reverse Breakdown Voltage 
‐45 
‐‐ 
V
F
 
Forward Voltage 
‐‐ 
0.8 
C
rSS
 
Total Reverse Capacitance 
‐‐ 
1.5 
I
R
 
Maximum Reverse Leakage Current 
‐‐ 
‐‐ 
Click To Buy
MAX. 
‐‐ 
1.5 
‐50 
UNITS 
pF 
pA 
TO-72 (Bottom View)
CONDITIONS 
I
= ‐1µA 
I
= 5mA 
V
= ‐5V, f = 1MHz 
V
= ‐ 20V 
Notes:
1. Absolute maximum ratings are limiting values above which LSPAD50 serviceability may be impaired.
Available Packages:
LSPAD50 in TO-72
LSPAD50 available as bare die
Please contact Micross for full package and die dimensions
A
2
Micross Components Europe
Tel: +44 1603 788967
Email:
chipcomponents@micross.com
Web:
http://www.micross.com/distribution.com
1
3
C
C
Information furnished by Linear Integrated Systems and Micross Components is believed to be accurate and reliable. However, no responsibility is assumed for its use; nor for any infringement of patents or
other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Linear Integrated Systems.
Micross Components Ltd, United Kingdom, Tel: +44 1603 788967, Fax: +44 1603788920, Email:
baredie@micross.com
Web:
www.micross.com/distribution.aspx
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