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GS8662D11BGD-333I

Description
Standard SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
Categorystorage    storage   
File Size690KB,34 Pages
ManufacturerGSI Technology
Websitehttp://www.gsitechnology.com/
Environmental Compliance
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GS8662D11BGD-333I Overview

Standard SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165

GS8662D11BGD-333I Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerGSI Technology
Parts packaging codeBGA
package instruction15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
Contacts165
Reach Compliance Codecompliant
ECCN code3A991.B.2.B
Maximum access time0.45 ns
Other featuresPIPELINED ARCHITECTURE
JESD-30 codeR-PBGA-B165
JESD-609 codee1
length15 mm
memory density75497472 bit
Memory IC TypeSTANDARD SRAM
memory width9
Humidity sensitivity level3
Number of functions1
Number of terminals165
word count8388608 words
character code8000000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize8MX9
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, LOW PROFILE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.4 mm
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width13 mm
Preliminary
GS8662D06/20/38BD-550/500/450/400/350
GS8662D11BD-500/450/400/350
165-Bump BGA
Commercial Temp
Industrial Temp
Features
• 2.5 Clock Latency
• Simultaneous Read and Write SigmaQuad™ Interface
• JEDEC-standard pinout and package
• Dual Double Data Rate interface
• Byte Write controls sampled at data-in time
• Burst of 4 Read and Write
• On-Die Termination (ODT) on Data (D), Byte Write (BW),
and Clock (K, K) intputs
• 1.8 V +100/–100 mV core power supply
• 1.5 V or 1.8 V HSTL Interface
• Pipelined read operation
• Fully coherent read and write pipelines
• ZQ pin for programmable output drive strength
• Data Valid Pin (QVLD) Support
• IEEE 1149.1 JTAG-compliant Boundary Scan
• 165-bump, 13 mm x 15 mm, 1 mm bump pitch BGA package
• RoHS-compliant 165-bump BGA package available
72Mb SigmaQuad-II+
TM
Burst of 4 SRAM
550 MHz–350 MHz
1.8 V V
DD
1.8 V or 1.5 V I/O
SRAMs. The GS8662D06/11/20/38BD SigmaQuad SRAMs
are just one element in a family of low power, low voltage
HSTL I/O SRAMs designed to operate at the speeds needed to
implement economical high performance networking systems.
Clocking and Addressing Schemes
The GS8662D06/11/20/38BD SigmaQuad-II+ SRAMs are
synchronous devices. They employ two input register clock
inputs, K and K. K and K are independent single-ended clock
inputs, not differential inputs to a single differential clock input
buffer.
Because Separate I/O SigmaQuad-II+ B4 RAMs always
transfer data in four packets, A0 and A1 are internally set to 0
for the first read or write transfer, and automatically
incremented by 1 for the next transfers. Because the LSBs are
tied off internally, the address field of a SigmaQuad-II+ B4
RAM is always two address pins less than the advertised index
depth (e.g., the 4M x 18 has a 1M addressable index).
SigmaQuad-II™ Family Overview
The GS8662D06/11/20/38BD are built in compliance with
the SigmaQuad-II+ SRAM pinout standard for Separate I/O
synchronous SRAMs. They are 75,497,472-bit (72Mb)
Parameter Synopsis (x8/x18/x36)
-550
tKHKH
tKHQV
1.81 ns
0.29ns
-500
2.0 ns
0.33 ns
-450
2.2 ns
0.37 ns
-400
2.5 ns
0.45 ns
-350
2.86 ns
0.45 ns
Parameter Synopsis (x9)
-500
tKHKH
tKHQV
2.0 ns
0.33 ns
-450
2.2 ns
0.37ns
-400
2.5 ns
0.45 ns
-350
2.86 ns
0.45 ns
Rev: 1.01 11/2010
1/34
© 2010, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

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