1200 BAUD FFSK MODEM
| Parameter Name | Attribute value |
| Maker | CML Microcircuits |
| Parts packaging code | DIP |
| package instruction | DIP, DIP22,.4 |
| Contacts | 22 |
| Reach Compliance Code | unknown |
| Other features | FULL DUPLEX |
| JESD-30 code | R-GDIP-T22 |
| length | 27.18 mm |
| Number of functions | 1 |
| Number of terminals | 22 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -30 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP22,.4 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Maximum seat height | 5.39 mm |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Telecom integrated circuit types | MODEM |
| Temperature level | OTHER |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 10.16 mm |
| Base Number Matches | 1 |
| FX419J | FX419LG | FX419LH | FX419 | |
|---|---|---|---|---|
| Description | 1200 BAUD FFSK MODEM | 1200 BAUD FFSK MODEM | 1200 BAUD FFSK MODEM | 1200 BAUD FFSK MODEM |
| Maker | CML Microcircuits | CML Microcircuits | CML Microcircuits | - |
| Parts packaging code | DIP | QFP | QLCC | - |
| package instruction | DIP, DIP22,.4 | QFP, QFP24,.6SQ,50 | QCCJ, LDCC28,.5SQ | - |
| Contacts | 22 | 24 | 28 | - |
| Reach Compliance Code | unknown | unknown | unknown | - |
| Other features | FULL DUPLEX | FULL DUPLEX | FULL DUPLEX | - |
| JESD-30 code | R-GDIP-T22 | S-PQFP-G24 | S-PQCC-J28 | - |
| length | 27.18 mm | 10.12 mm | 11.5 mm | - |
| Number of functions | 1 | 1 | 1 | - |
| Number of terminals | 22 | 24 | 28 | - |
| Maximum operating temperature | 85 °C | 70 °C | 70 °C | - |
| Minimum operating temperature | -30 °C | -30 °C | -30 °C | - |
| Package body material | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| encapsulated code | DIP | QFP | QCCJ | - |
| Encapsulate equivalent code | DIP22,.4 | QFP24,.6SQ,50 | LDCC28,.5SQ | - |
| Package shape | RECTANGULAR | SQUARE | SQUARE | - |
| Package form | IN-LINE | FLATPACK | CHIP CARRIER | - |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - |
| Maximum seat height | 5.39 mm | 2.5 mm | 4.5 mm | - |
| Nominal supply voltage | 5 V | 5 V | 5 V | - |
| surface mount | NO | YES | YES | - |
| technology | CMOS | CMOS | CMOS | - |
| Telecom integrated circuit types | MODEM | MODEM | MODEM | - |
| Temperature level | OTHER | OTHER | OTHER | - |
| Terminal form | THROUGH-HOLE | GULL WING | J BEND | - |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.3 mm | - |
| Terminal location | DUAL | QUAD | QUAD | - |
| width | 10.16 mm | 10.12 mm | 11.5 mm | - |
| Base Number Matches | 1 | 1 | 1 | - |