SPC563M64B2COAR datasheet, PDF

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SPC563M64B2COAR: Description32-BIT, FLASH, 80MHz, MICROCONTROLLER, PBGA208, 17 X 17 MM, 1.55 MM HEIGHT, LEAD FREE, LFBGA-208; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，142 Pages; ManufacturerSTMicroelectronics; Websitehttp://www.st.com/; Environmental Compliance

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SPC563M64B2COAR Overview

32-BIT, FLASH, 80MHz, MICROCONTROLLER, PBGA208, 17 X 17 MM, 1.55 MM HEIGHT, LEAD FREE, LFBGA-208

SPC563M64B2COAR Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	STMicroelectronics
Parts packaging code	BGA
package instruction	17 X 17 MM, 1.55 MM HEIGHT, LEAD FREE, LFBGA-208
Contacts	208
Reach Compliance Code	compliant
ECCN code	3A001.A.3
Has ADC	YES
Address bus width
bit size	32
CPU series	SPC56
maximum clock frequency	80 MHz
DAC channel	NO
DMA channel	YES
External data bus width
JESD-30 code	S-PBGA-B208
length	17 mm
Number of I/O lines	64
Number of terminals	208
Maximum operating temperature	125 °C
Minimum operating temperature	-40 °C
PWM channel	YES
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Encapsulate equivalent code	BGA208,16X16,40
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.2,3.3,5 V
Certification status	Not Qualified
RAM (bytes)	96256
rom(word)	1572864
ROM programmability	FLASH
Maximum seat height	1.7 mm
speed	80 MHz
Maximum slew rate	195 mA
Maximum supply voltage	1.32 V
Minimum supply voltage	1.14 V
Nominal supply voltage	1.2 V
surface mount	YES
technology	CMOS
Temperature level	AUTOMOTIVE
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	17 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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SPC563Mxx

32-bit Power Architecture™ based MCU for automotive

powertrain applications

Preliminary data

Features

■

Single issue, 32-bit PowerPC

™

Book E

compliant e200z335 CPU core complex

– Includes variable length encoding (VLE)

enhancements for code size reduction

32-channel direct memory access controller

(DMA)

Interrupt controller (INTC) capable of handling

364 selectable-priority interrupt sources: 191

peripheral interrupt sources, 8 software

interrupts and 165 reserved interrupts.

Frequency-modulated phase-locked loop

(FMPLL)

Calibration external bus interface (EBI)

System integration unit (SIU)

Up to 1.5 Mbyte on-chip Flash with Flash

controller

– Fetch Accelerator for single cycle Flash

access @80 MHz

Up to 94 Kbyte on-chip static RAM (including

up to 32 Kbyte standby RAM)

Boot assist module (BAM)

32-channel second-generation enhanced time

processor unit (eTPU)

– 32 standard eTPU channels

(a)

■

LQFP144

20 mm x 20 mm

LQFP100

14 mm x 14 mm

LQFP176

24 mm x 24 mm

LFBGA208

17 mm x 17 mm

x 1.55 mm

■

– Architectural enhancements to improve

code efficiency and added flexibility

16-channels enhanced modular input-output

system (eMIOS)

Enhanced queued analog-to-digital converter

(eQADC)

Decimation filter (part of eQADC)

Silicon die temperature sensor

2 deserial serial peripheral interface (DSPI)

modules (compatible with Microsecond Bus)

2 enhanced serial communication interface

(eSCI) modules compatible with LIN

2 controller area network (FlexCAN) modules

that support CAN 2.0B

Nexus port controller (NPC) per IEEE-ISTO

5001-2003 standard

IEEE 1149.1 (JTAG) support

Nexus interface

On-chip voltage regulator controller that

provides 1.2 V and 3.3 V internal supplies from

a 5 V external source.

Available in LQFP100, LQFP144, LQFP176

and LBGA208.

■

a. The external bus interface is only accessible when

using the calibration tool. It is not available on

production packages.

■

Table 1.

Device summary

Part number

Package: LQFP100

SPC563M54L3

SPC563M60L3

SPC563M64L3

Package: LQFP144

SPC563M54L5

SPC563M60L5

SPC563M64L5

SPC563M60L7

SPC563M64L7

SPC563M60B2

SPC563M64B2

Package: LQFP176

Package: LBGA208

Memory Flash size

768 Kbyte

1024 Kbyte

1536 Kbyte

December 2009

Doc ID 14642 Rev4

1/142

www.st.com

This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to

change without notice.

SPC563Mxx

Contents

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

1.1

1.2

1.3

Device comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

SPC563Mxx features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

SPC563Mxx feature details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

1.3.1

1.3.2

1.3.3

1.3.4

1.3.5

1.3.6

1.3.7

1.3.8

1.3.9

1.3.10

1.3.11

1.3.12

1.3.13

1.3.14

1.3.15

1.3.16

1.3.17

1.3.18

1.3.19

1.3.20

1.3.21

e200z335 core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Crossbar . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

eDMA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Interrupt controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

FMPLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Calibration EBI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

SIU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

ECSM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

BAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

eMIOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

eTPU2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

eQADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

DSPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

eSCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

FlexCAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

System timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

Software Watchdog Timer (SWT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

Nexus Port Controller (NPC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39

JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

1.4

SPC563Mxx series architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

1.4.1

1.4.2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Block summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Pinout and signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

2.1

2.2

2.3

LQFP100 pinout (all 100-pin devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

LQFP144 pinout (all 144-pin devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

LQFP176 pinout (SPC563M64) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48

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Contents

SPC563Mxx

2.4

2.5

2.6

2.7

2.8

LQFP176 pinout (SPC563M60) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

LBGA208 ballmap (SPC563M64) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

LBGA208 ballmap (SPC563M60 only) . . . . . . . . . . . . . . . . . . . . . . . . . . . 51

Signal summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

Signal Details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

3.1

3.2

3.3

3.4

3.5

3.6

Parameter classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

3.3.1

General notes for specifications at maximum junction temperature . . . 80

EMI (Electromagnetic Interference) characteristics . . . . . . . . . . . . . . . . . 83

Electromagnetic Static Discharge (ESD) characteristics . . . . . . . . . . . . . 83

Power Management Control (PMC) and Power On Reset (POR) electrical

specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

3.6.1

3.6.2

Regulator example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

Recommended power transistors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

3.7

3.8

3.9

Power up/down sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

DC electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

I/O Pad current specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

3.9.1

3.9.2

I/O pad VRC33 current specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 97

LVDS pad specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

3.10

3.11

3.12

3.13

3.14

3.15

3.16

Oscillator and PLLMRFM electrical characteristics . . . . . . . . . . . . . . . . . 99

Temperature sensor electrical characteristics . . . . . . . . . . . . . . . . . . . . 101

eQADC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101

Platform flash controller electrical characteristics . . . . . . . . . . . . . . . . . 103

Flash memory electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 103

AC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

3.15.1

Pad AC specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

AC timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

3.16.1

3.16.2

3.16.3

3.16.4

3.16.5

IEEE 1149.1 interface timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

Nexus timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

Calibration bus interface timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

eMIOS timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118

DSPI timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119

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Doc ID 14642 Rev 4

List of tables

SPC563Mxx

List of tables

Table 1.

Table 2.

Table 3.

Table 4.

Table 5.

Table 6.

Table 7.

Table 8.

Table 9.

Table 10.

Table 11.

Table 12.

Table 13.

Table 14.

Table 15.

Table 16.

Table 17.

Table 18.

Table 19.

Table 20.

Table 21.

Table 22.

Table 23.

Table 24.

Table 25.

Table 26.

Table 27.

Table 28.

Table 29.

Table 30.

Table 31.

Table 32.

Table 33.

Table 34.

Table 35.

Table 36.

Table 37.

Table 38.

Table 39.

Table 40.

Table 41.

Table 42.

Table 43.

Table 44.

Table 45.

Table 46.

Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

SPC563Mxx family device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

SPC563Mxx series block summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

SPC563Mx signal properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

Pad types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

Signal details . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71

Power/ground segmentation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

Parameter classifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76

Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77

Thermal characteristics for 100-pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78

Thermal characteristics for 144-pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

Thermal characteristics for 176-pin LQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

Thermal characteristics for 208-pin LBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

EMI testing specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

ESD ratings, . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

PMC Operating conditions and external regulators supply voltage . . . . . . . . . . . . . . . . . . 84

PMC electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84

Recommended operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88

Power sequence pin states for fast pads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

Power sequence pin states for medium, slow and multi-voltage pads . . . . . . . . . . . . . . . . 89

DC electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89

I/O pad average I

DDE

specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

I/O pad VRC33 average I

DDE

specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97

VRC33 pad average DC current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

DSPI LVDS pad specification

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98

PLLMRFM electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99

Temperature sensor electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101

eQADC conversion specifications (operating) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101

APC, RWSC, WWSC settings vs. frequency of operation . . . . . . . . . . . . . . . . . . . . . . . . 103

Program and erase specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103

Flash module life. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103

Pad AC specifications (5.0 V)

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105

Pad AC specifications (3.3 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

Pad AC specifications (1.8 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108

JTAG pin AC electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109

Nexus debug port timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112

Calibration bus operation timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115

eMIOS timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118

DSPI timing

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119

eQADC SSI timing characteristics (pads at 3.3 V or at 5.0 V) . . . . . . . . . . . . . . . . . . . . . 125

LQFP100 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

LQFP144 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129

LQFP176 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134

LBGA208 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136

Orderable part number summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137

Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139

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Doc ID 14642 Rev 4

SPC563M64B2COAR Related Products

	SPC563M64B2COAR	SPC563M60L5COCY	SPC563M60L5COCR	SPC563M54L5COBY	SPC563M60B2COAY	SPC563M60B2COAR	SPC563M54L5COBR
Description	32-BIT, FLASH, 80MHz, MICROCONTROLLER, PBGA208, 17 X 17 MM, 1.55 MM HEIGHT, LEAD FREE, LFBGA-208	32-BIT, FLASH, 80MHz, MICROCONTROLLER, PQFP144, 20 X 20 MM, LEAD FREE, PLASTIC, LQFP-144	32-BIT, FLASH, 80MHz, MICROCONTROLLER, PQFP144, 20 X 20 MM, LEAD FREE, PLASTIC, LQFP-144	32-BIT, FLASH, 64MHz, MICROCONTROLLER, PQFP144, 20 X 20 MM, LEAD FREE, PLASTIC, LQFP-144	32-BIT, FLASH, 80MHz, MICROCONTROLLER, PBGA208, 17 X 17 MM, 1.55 MM HEIGHT, LEAD FREE, LFBGA-208	32-BIT, FLASH, 80MHz, MICROCONTROLLER, PBGA208, 17 X 17 MM, 1.55 MM HEIGHT, LEAD FREE, LFBGA-208	32-BIT, FLASH, 64MHz, MICROCONTROLLER, PQFP144, 20 X 20 MM, LEAD FREE, PLASTIC, LQFP-144
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	BGA	QFP	QFP	QFP	BGA	BGA	QFP
package instruction	17 X 17 MM, 1.55 MM HEIGHT, LEAD FREE, LFBGA-208	20 X 20 MM, LEAD FREE, PLASTIC, LQFP-144	20 X 20 MM, LEAD FREE, PLASTIC, LQFP-144	LFQFP, QFP144,.87SQ,20	17 X 17 MM, 1.55 MM HEIGHT, LEAD FREE, LFBGA-208	17 X 17 MM, 1.55 MM HEIGHT, LEAD FREE, LFBGA-208	20 X 20 MM, LEAD FREE, PLASTIC, LQFP-144
Contacts	208	144	144	144	208	208	144
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compli
ECCN code	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
Has ADC	YES	YES	YES	YES	YES	YES	YES
bit size	32	32	32	32	32	32	32
CPU series	SPC56	SPC56	SPC56	SPC56	SPC56	SPC56	SPC56
maximum clock frequency	80 MHz	80 MHz	80 MHz	80 MHz	80 MHz	80 MHz	80 MHz
DAC channel	NO	NO	NO	NO	NO	NO	NO
DMA channel	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	S-PBGA-B208	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	S-PBGA-B208	S-PBGA-B208	S-PQFP-G144
length	17 mm	20 mm	20 mm	20 mm	17 mm	17 mm	20 mm
Number of I/O lines	64	64	64	64	64	64	64
Number of terminals	208	144	144	144	208	208	144
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM channel	YES	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LBGA	LFQFP	LFQFP	LFQFP	LBGA	LBGA	LFQFP
Encapsulate equivalent code	BGA208,16X16,40	QFP144,.87SQ,20	QFP144,.87SQ,20	QFP144,.87SQ,20	BGA208,16X16,40	BGA208,16X16,40	QFP144,.87SQ,20
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	1.2,3.3,5 V	1.2,3.3,5 V	1.2,3.3,5 V	1.2,3.3,5 V	1.2,3.3,5 V	1.2,3.3,5 V	1.2,3.3,5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	96256	65536	65536	49152	65536	65536	49152
rom(word)	1572864	1048576	1048576	786432	1048576	1048576	786432
ROM programmability	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
Maximum seat height	1.7 mm	1.6 mm	1.6 mm	1.6 mm	1.7 mm	1.7 mm	1.6 mm
speed	80 MHz	80 MHz	80 MHz	64 MHz	80 MHz	80 MHz	64 MHz
Maximum slew rate	195 mA	195 mA	195 mA	195 mA	195 mA	195 mA	195 mA
Maximum supply voltage	1.32 V	1.32 V	1.32 V	1.32 V	1.32 V	1.32 V	1.32 V
Minimum supply voltage	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V	1.14 V
Nominal supply voltage	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V	1.2 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE
Terminal form	BALL	GULL WING	GULL WING	GULL WING	BALL	BALL	GULL WING
Terminal pitch	1 mm	0.5 mm	0.5 mm	0.5 mm	1 mm	1 mm	0.5 mm
Terminal location	BOTTOM	QUAD	QUAD	QUAD	BOTTOM	BOTTOM	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	17 mm	20 mm	20 mm	20 mm	17 mm	17 mm	20 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Maker	STMicroelectronics	-	-	STMicroelectronics	STMicroelectronics	STMicroelectronics	STMicroelectronics
On-chip program ROM width	-	8	8	8	8	8	8

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