BAS70TW /DW-04 /DW-05 /DW-06 /BRW
SURFACE MOUNT SCHOTTKY BARRIER DIODE ARRAYS
Product Summary
V
R
(V)
70
I
F
(mA)
1.0
V
F MAX
(V)
@ +25°
C
0.41
I
R MAX
(µA)
@ +25°
C
0.10
Features
Low Forward Voltage Drop
Fast Switching
Ultra-Small Surface Mount Package
PN Junction Guard Ring for Transient and ESD Protection
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
PPAP Capable (Note 4)
Description and Applications
This Schottky Barrier Arrays is designed with low leakage
performance in a variety of configurations. This reduces
component placement costs by requiring only one component.
Designed to meet AEC-Q101 requirements. Configurations are
ideally suited to use as:
Polarity Protection Diode
Rail-to-Rail Data Line Protection for Two Data Lines
Multiplexing Circuits
High-Efficiency, Low-Current Bridge Rectifier Circuits
Re-Circulating Diode
Switching Diode
Mechanical Data
Case: SOT363
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Lead Free Plating (Matte Tin Finish Annealed over
Alloy 42 Leadframe). Solderable per MIL-STD-202, Method 208
Orientation: See Diagrams Below
Weight: 0.006 grams (Approximate)
AC
1
C
1
C
2
AC
1
C
2
A
2
C
1
A
2
A
2
A
1
C
2
C
2
C
1
C
2
C
3
A
1
A
2
AC
2
A
1
C
1
AC
2
A
1
A
1
C
2
C
1
C
1
A
2
A
1
A
2
A
3
Top View
BAS70BRW
BAS70DW-04*
BAS70DW-05*
BAS70DW-06*
BAS70TW
*Symmetrical configuration, no orientation indicator.
Ordering Information
(Notes 5 & 6)
Part Number
BAS70DW-04-7-F
BAS70DW-04-13-F
BAS70DW-05-7-F
BAS70DW-05Q-7-F
BAS70DW-06-7-F
BAS70BRW-7-F
BAS70TW-7-F
BAS70TW-13-F
Notes:
Compliance
AEC-Q101
AEC-Q101
AEC-Q101
Automotive
AEC-Q101
AEC-Q101
AEC-Q101
AEC-Q101
Case
SOT363
SOT363
SOT363
SOT363
SOT363
SOT363
SOT363
SOT363
Packaging
3000/Tape & Reel
10000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
3000/Tape & Reel
10000/Tape & Reel
1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Automotive, AEC-Q101 and standard products are electrically and thermally
the same, except where specified. For more information, please refer to http://www.diodes.com/product_compliance_definitions.html.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
6. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
BAS70TW /DW-04
/DW-05 /DW-06 /BRW
Document Number: DS30158 Rev. 14 - 2
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Marking Information
Kxx = Product Type Marking Code
For Symmetrical Configuration, No Orientation Indicator
K75 = BAS70BRW
K74 = BAS70DW-04
K71 = BAS70DW-05
K76 = BAS70DW-06
K73 = BAS70TW
YM = Date Code Marking
Y = Year (ex: D = 2016)
M = Month (ex: 9 = September)
2019
G
May
5
Jun
6
Jul
7
2020
H
Aug
8
2021
I
Sep
9
Oct
O
2022
J
Nov
N
2023
K
Dec
D
Date Code Key
Year
Code
Month
Code
2016
D
Jan
1
Feb
2
2017
E
Mar
3
Maximum Ratings
(@T
A
= +25° unless otherwise specified.)
C,
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 7)
Non-Repetitive Peak Forward Surge Current
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
FM
I
FSM
Value
70
49
70
100
Unit
V
V
mA
mA
Thermal Characteristics
Characteristic
Power Dissipation (Note 8)
Thermal Resistance Junction to Ambient Air (Note 8)
Operating and Storage Temperature Range
Symbol
P
D
R
JA
T
J
T
STG
Value
200
625
-55 to +125
-65 to +125
Unit
mW
C/W
C
Electrical Characteristics
(@T
A
= +25° unless otherwise specified.)
C,
Characteristic
Reverse Breakdown Voltage (Note 7)
Forward Voltage
Reverse Current (Note 7)
Total Capacitance
Reverse Recovery Time
Notes:
7. Short duration pulse test used to minimize self-heating effect.
8. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/package-outlines.html.
BAS70TW /DW-04
/DW-05 /DW-06 /BRW
Document Number: DS30158 Rev. 14 - 2
K YM
xx
2018
F
Apr
4
@ t < 1.0s
K
xx
YM
K YM
xx
Symbol
V
(BR)R
V
F
I
R
C
T
t
RR
Min
70
Max
410
1000
100
2.0
5.0
Unit
V
mV
mV
nA
pF
ns
Test Condition
I
R
= 10µA
t
p
<300µs, I
F
= 1.0mA
t
p
<300µs, I
F
= 15mA
t
p
< 300µs, V
R
= 50V
V
R
= 0V,
f
= 1.0MHz
I
F
= I
R
= 10mA to I
R
= 1.0mA,
I
RR
= 0.1 x I
R
, R
L
= 100Ω
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BAS70TW /DW-04 /DW-05 /DW-06 /BRW
I
F
, INSTANTANEOUS FORWARD CURRENT (mA)
T
A
=
A
= 125篊
T
125 C
T
A
75 C
T
A
=
= 75篊
T
= 25 C
T
A
A
= 25篊
o
o
o
I
R
, INSTANTANEOUS REVERSE CURRENT (nA)
100
10,000
1,000
10
100
10
1.0
1
T
A
A
= 0
o
C
T
= 0篊
0.1
0
T
= -40篊
T
A
A
= -40 C
o
0.2 0.4 0.6
0.8 1.0 1.2 1.4 1.6
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 1 Typical Forward Characteristics
0.1
0
10
20
30
40
50
60
70
V
R
, INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 2 Typical Reverse Characteristics
1.8
1.6
P
D
, POWER DISSIPATION (mW)
250
Note 8
C
T
, TOTAL CAPACITANCE (pF)
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
200
150
100
50
0
20
25
35
40
10
15
30
V
R
, DC REVERSE VOLTAGE (V)
Fig. 3 Total Capacitance vs. Reverse Voltage
5
0
40
80
120
200
160
T
A
, AMBIENT TEMPERATURE (°
C)
Fig. 4 Power Derating Curve, Total Package
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/DW-05 /DW-06 /BRW
Document Number: DS30158 Rev. 14 - 2
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Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT363
E
E1
F
b
D
A2
c
A1
e
L
SOT363
Dim Min Max
Typ
A1
0.00 0.10
0.05
A2
0.90 1.00
1.00
b
0.10 0.30
0.25
c
0.10 0.22
0.11
D
1.80 2.20
2.15
E
2.00 2.20
2.10
E1
1.15 1.35
1.30
e
0.650 BSC
F
0.40 0.45 0.425
L
0.25 0.40
0.30
a
0°
8°
--
All Dimensions in mm
a
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOT363
C
Dimensions
Y1
G
Y
C
G
X
Y
Y1
Value
(in mm)
0.650
1.300
0.420
0.600
2.500
X
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/DW-05 /DW-06 /BRW
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2016, Diodes Incorporated
www.diodes.com
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/DW-05 /DW-06 /BRW
Document Number: DS30158 Rev. 14 - 2
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