BAV70DW
SURFACE MOUNT SWITCHING DIODE ARRAY
Features
•
•
•
•
•
•
•
Fast Switching Speed
Ultra-Small Surface Mount Package
For General Purpose Switching Applications
High Conductance
Two “BAV70” Circuits In One Package
Lead Free/RoHS Compliant (Note 3)
"Green" Device (Note 4 and 5)
Mechanical Data
•
•
•
•
•
•
•
•
•
SOT-363
Case: SOT-363
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
Orientation: See Diagram
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.006 grams (approximate)
C
1
A
2
A
2
A
1
A
1
C
2
TOP VIEW
TOP VIEW
Internal Schematic
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Symbol
V
RM
V
RRM
V
RWM
V
R
V
R(RMS)
I
FM
I
O
@ t = 1.0μs
@ t = 1.0s
I
FSM
Value
100
75
53
300
150
2.0
1.0
Unit
V
V
V
mA
mA
A
Characteristic
Non-Repetitive Peak Reverse Voltage
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 1)
Average Rectified Output Current (Note 1)
Non-Repetitive Peak Forward Surge Current
Thermal Characteristics
Characteristic
Power Dissipation (Note 1)
Thermal Resistance Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Symbol
P
D
R
θ
JA
T
J
, T
STG
Value
200
625
-65 to +150
Unit
mW
°C/W
°C
Electrical Characteristics
Characteristic
Reverse Breakdown Voltage (Note 2)
Forward Voltage
@T
A
= 25°C unless otherwise specified
Symbol
V
(BR)R
V
F
Min
75
⎯
Max
⎯
0.715
0.855
1.0
1.25
2.5
50
30
25
2.0
4.0
Unit
V
V
μA
μA
μA
nA
pF
ns
Test Condition
I
F
= 2.5μA
I
F
= 1.0mA
I
F
= 10mA
I
F
= 50mA
I
F
= 150mA
V
R
= 75V
V
R
= 75V, T
J
= 150°C
V
R
= 25V, T
J
= 150°C
V
R
= 20V
V
R
= 0, f = 1.0MHz
I
F
= I
R
= 10mA,
I
rr
= 0.1 x I
R
, R
L
= 100Ω
Reverse Current (Note 2)
Total Capacitance
Reverse Recovery Time
Notes:
I
R
C
T
t
rr
⎯
⎯
⎯
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb
2
O
3
Fire Retardants.
BAV70DW
Document number: DS30132 Rev. 11 - 2
1 of 3
www.diodes.com
April 2008
© Diodes Incorporated
BAV70DW
I
F
, INSTANTANEOUS FORWARD CURRENT (A)
300
Note 1
1
P
D
, POWER DISSIPATION (mW)
250
200
0.1
150
100
0.01
50
0
0
75
25
50
100
125
150
T
A
, AMBIENT TEMPERATURE (
°
C)
Fig. 1 Power Derating Curve, Total Package
0.001
1.0
0.5
1.5
0
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics, Per Element
I
R
, INSTANTANEOUS REVERSE CURRENT (nA)
10,000
2.0
1.8
C
T
, TOTAL CAPACITANCE (pF)
1,000
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
100
10
1
0.1
0
0.0
10
30
40
20
V
R
, DC REVERSE VOLTAGE (V)
Fig. 4 Total Capacitance vs. Reverse Voltage, Per Element
0
60
80
100
20
40
V
R
, INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 3 Typical Reverse Characteristics, Per Element
Ordering Information
Part Number
BAV70DW-7-F
Notes:
(Note 6)
Case
SOT-363
Packaging
3000/Tape & Reel
6. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
KJA = Product Type Marking Code
YM = Date Code Marking
Y = Year ex: N = 2002
M = Month ex: 9 = September
KJA YM
KJA YM
Date Code Key
Year
Code
Month
Code
2001
M
Jan
1
2002
N
Feb
2
2003
P
Mar
3
2004
R
Apr
4
2005
S
May
5
2006
T
Jun
6
2007
U
Jul
7
2008
V
Aug
8
2009
W
Sep
9
2010
X
Oct
O
2111
Y
Nov
N
2012
Z
Dec
D
BAV70DW
Document number: DS30132 Rev. 11 - 2
2 of 3
www.diodes.com
April 2008
© Diodes Incorporated
BAV70DW
Package Outline Dimensions
A
B C
H
K
M
J
D
F
L
SOT-363
Dim
Min
Max
A
0.10
0.30
B
1.15
1.35
C
2.00
2.20
D
0.65 Nominal
F
0.30
0.40
H
1.80
2.20
J
0.10
⎯
K
0.90
1.00
L
0.25
0.40
M
0.10
0.25
0°
8°
α
All Dimensions in mm
Suggested Pad Layout
E
E
Z
G
C
Dimensions Value (in mm)
Z
2.5
G
1.3
X
0.42
Y
0.6
C
1.9
E
0.65
Y
X
IMPORTANT NOTICE
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product
described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall
assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,
harmless against all damages.
LIFE SUPPORT
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written
approval of the President of Diodes Incorporated.
BAV70DW
Document number: DS30132 Rev. 11 - 2
3 of 3
www.diodes.com
April 2008
© Diodes Incorporated
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
