AND-OR-Invert Gate, CMOS,
| Parameter Name | Attribute value |
| Maker | RCA |
| package instruction | , DIE OR CHIP |
| Reach Compliance Code | unknown |
| Logic integrated circuit type | AND-OR-INVERT GATE |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Encapsulate equivalent code | DIE OR CHIP |
| power supply | 5/15 V |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| CD4086BH | CD4086BE | CD4086BF | CD4086BD | CD4086BK | |
|---|---|---|---|---|---|
| Description | AND-OR-Invert Gate, CMOS, | AND-OR-Invert Gate, CMOS, PDIP14, | AND-OR-Invert Gate, CMOS, CDIP14, | AND-OR-Invert Gate, CMOS, CDIP14, | AND-OR-Invert Gate, CMOS, CDFP14, |
| Maker | RCA | RCA | RCA | RCA | RCA |
| package instruction | , DIE OR CHIP | DIP, DIP14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknow |
| Logic integrated circuit type | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE |
| Maximum operating temperature | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C |
| Encapsulate equivalent code | DIE OR CHIP | DIP14,.3 | DIP14,.3 | DIP14,.3 | FL14,.3 |
| power supply | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | INDUSTRIAL | MILITARY | MILITARY | MILITARY |
| Is it Rohs certified? | - | incompatible | incompatible | incompatible | incompatible |
| JESD-30 code | - | R-PDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDFP-F14 |
| JESD-609 code | - | e0 | e0 | e0 | e0 |
| Number of terminals | - | 14 | 14 | 14 | 14 |
| Package body material | - | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | - | DIP | DIP | DIP | DFP |
| Package shape | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | - | IN-LINE | IN-LINE | IN-LINE | FLATPACK |
| surface mount | - | NO | NO | NO | YES |
| Terminal surface | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| Terminal pitch | - | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | - | DUAL | DUAL | DUAL | DUAL |
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