AND-OR-Invert Gate, CMOS, CDFP14,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | RCA |
| package instruction | DFP, FL14,.3 |
| Reach Compliance Code | unknow |
| JESD-30 code | R-XDFP-F14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | AND-OR-INVERT GATE |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL14,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| power supply | 5/15 V |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |

| CD4086BK | CD4086BE | CD4086BF | CD4086BH | CD4086BD | |
|---|---|---|---|---|---|
| Description | AND-OR-Invert Gate, CMOS, CDFP14, | AND-OR-Invert Gate, CMOS, PDIP14, | AND-OR-Invert Gate, CMOS, CDIP14, | AND-OR-Invert Gate, CMOS, | AND-OR-Invert Gate, CMOS, CDIP14, |
| Maker | RCA | RCA | RCA | RCA | RCA |
| package instruction | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 | , DIE OR CHIP | DIP, DIP14,.3 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown |
| Logic integrated circuit type | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE |
| Maximum operating temperature | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -40 °C | -55 °C | -55 °C | -55 °C |
| Encapsulate equivalent code | FL14,.3 | DIP14,.3 | DIP14,.3 | DIE OR CHIP | DIP14,.3 |
| power supply | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | INDUSTRIAL | MILITARY | MILITARY | MILITARY |
| Is it Rohs certified? | incompatible | incompatible | incompatible | - | incompatible |
| JESD-30 code | R-XDFP-F14 | R-PDIP-T14 | R-XDIP-T14 | - | R-XDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | - | e0 |
| Number of terminals | 14 | 14 | 14 | - | 14 |
| Package body material | CERAMIC | PLASTIC/EPOXY | CERAMIC | - | CERAMIC |
| encapsulated code | DFP | DIP | DIP | - | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| Package form | FLATPACK | IN-LINE | IN-LINE | - | IN-LINE |
| surface mount | YES | NO | NO | - | NO |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | THROUGH-HOLE | THROUGH-HOLE | - | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | - | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | - | DUAL |