MC68010CL12 datasheet, PDF - EEWORLD Datasheet

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MC68010CL12: DescriptionMicroprocessor, 16-Bit, 12.5MHz, NMOS, CDIP64, CERAMIC, DIP-64; CategoryThe embedded processor and controller Microcontrollers and processors; File Size953KB，37 Pages; ManufacturerMotorola ( NXP ); Websitehttps://www.nxp.com

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MC68010CL12 Overview

Microprocessor, 16-Bit, 12.5MHz, NMOS, CDIP64, CERAMIC, DIP-64

MC68010CL12 Parametric

Parameter Name	Attribute value
Maker	Motorola ( NXP )
package instruction	DIP,
Reach Compliance Code	unknown
Address bus width	24
bit size	16
boundary scan	NO
maximum clock frequency	12.5 MHz
External data bus width	16
Format	FIXED POINT
Integrated cache	NO
JESD-30 code	R-CDIP-T64
length	81.28 mm
low power mode	YES
Number of DMA channels
Number of external interrupt devices	3
Number of serial I/Os
Number of terminals	64
On-chip data RAM width
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
RAM (number of words)	0
Maximum seat height	4.32 mm
speed	12.5 MHz
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	NO
technology	NMOS
Temperature level	INDUSTRIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	22.86 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR

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MC68010CL12 Related Products

	MC68010CL12	MC68010L8	MC68010CL8	MC68010CL10	MC68010L12
Description	Microprocessor, 16-Bit, 12.5MHz, NMOS, CDIP64, CERAMIC, DIP-64	16-BIT, 8MHz, MICROPROCESSOR, CDIP64, CERAMIC, DIP-64	16-BIT, 8MHz, MICROPROCESSOR, CDIP64, CERAMIC, DIP-64	16-BIT, 10MHz, MICROPROCESSOR, CDIP64, CERAMIC, DIP-64	16-BIT, 12.5 MHz, MICROPROCESSOR, CDIP64, CERAMIC, DIP-64
Maker	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )
package instruction	DIP,	DIP, DIP64,.9	DIP, DIP64,.9	DIP, DIP64,.9	DIP, DIP64,.9
Reach Compliance Code	unknown	unknown	unknown	unknow	unknow
Address bus width	24	24	24	24	24
bit size	16	16	16	16	16
boundary scan	NO	NO	NO	NO	NO
maximum clock frequency	12.5 MHz	8 MHz	8 MHz	10 MHz	12.5 MHz
External data bus width	16	16	16	16	16
Format	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	NO	NO	NO	NO	NO
JESD-30 code	R-CDIP-T64	R-CDIP-T64	R-CDIP-T64	R-CDIP-T64	R-CDIP-T64
length	81.28 mm	81.28 mm	81.28 mm	81.28 mm	81.28 mm
low power mode	YES	YES	YES	YES	YES
Number of external interrupt devices	3	3	3	3	3
Number of terminals	64	64	64	64	64
Maximum operating temperature	85 °C	70 °C	85 °C	85 °C	70 °C
Minimum operating temperature	-40 °C	-	-40 °C	-40 °C	-
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	DIP	DIP	DIP	DIP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.32 mm	4.32 mm	4.32 mm	4.32 mm	4.32 mm
speed	12.5 MHz	8 MHz	8 MHz	10 MHz	12.5 MHz
Maximum supply voltage	5.25 V	5.25 V	5.25 V	5.25 V	5.25 V
Minimum supply voltage	4.75 V	4.75 V	4.75 V	4.75 V	4.75 V
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO
technology	NMOS	NMOS	NMOS	NMOS	NMOS
Temperature level	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL
width	22.86 mm	22.86 mm	22.86 mm	22.86 mm	22.86 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR	MICROPROCESSOR
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible
Parts packaging code	-	DIP	DIP	DIP	DIP
Contacts	-	64	64	64	64
JESD-609 code	-	e0	e0	e0	e0
Encapsulate equivalent code	-	DIP64,.9	DIP64,.9	DIP64,.9	DIP64,.9
Peak Reflow Temperature (Celsius)	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED

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