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MC68010L8

Description
16-BIT, 8MHz, MICROPROCESSOR, CDIP64, CERAMIC, DIP-64
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size953KB,37 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

MC68010L8 Overview

16-BIT, 8MHz, MICROPROCESSOR, CDIP64, CERAMIC, DIP-64

MC68010L8 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMotorola ( NXP )
Parts packaging codeDIP
package instructionDIP, DIP64,.9
Contacts64
Reach Compliance Codeunknown
Address bus width24
bit size16
boundary scanNO
maximum clock frequency8 MHz
External data bus width16
FormatFIXED POINT
Integrated cacheNO
JESD-30 codeR-CDIP-T64
JESD-609 codee0
length81.28 mm
low power modeYES
Number of DMA channels
Number of external interrupt devices3
Number of serial I/Os
Number of terminals64
On-chip data RAM width
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Encapsulate equivalent codeDIP64,.9
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
RAM (number of words)0
Maximum seat height4.32 mm
speed8 MHz
Maximum supply voltage5.25 V
Minimum supply voltage4.75 V
Nominal supply voltage5 V
surface mountNO
technologyNMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width22.86 mm
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR

MC68010L8 Related Products

MC68010L8 MC68010CL12 MC68010CL8 MC68010CL10 MC68010L12
Description 16-BIT, 8MHz, MICROPROCESSOR, CDIP64, CERAMIC, DIP-64 Microprocessor, 16-Bit, 12.5MHz, NMOS, CDIP64, CERAMIC, DIP-64 16-BIT, 8MHz, MICROPROCESSOR, CDIP64, CERAMIC, DIP-64 16-BIT, 10MHz, MICROPROCESSOR, CDIP64, CERAMIC, DIP-64 16-BIT, 12.5 MHz, MICROPROCESSOR, CDIP64, CERAMIC, DIP-64
Maker Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP )
package instruction DIP, DIP64,.9 DIP, DIP, DIP64,.9 DIP, DIP64,.9 DIP, DIP64,.9
Reach Compliance Code unknown unknown unknown unknow unknow
Address bus width 24 24 24 24 24
bit size 16 16 16 16 16
boundary scan NO NO NO NO NO
maximum clock frequency 8 MHz 12.5 MHz 8 MHz 10 MHz 12.5 MHz
External data bus width 16 16 16 16 16
Format FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT
Integrated cache NO NO NO NO NO
JESD-30 code R-CDIP-T64 R-CDIP-T64 R-CDIP-T64 R-CDIP-T64 R-CDIP-T64
length 81.28 mm 81.28 mm 81.28 mm 81.28 mm 81.28 mm
low power mode YES YES YES YES YES
Number of external interrupt devices 3 3 3 3 3
Number of terminals 64 64 64 64 64
Maximum operating temperature 70 °C 85 °C 85 °C 85 °C 70 °C
Minimum operating temperature - -40 °C -40 °C -40 °C -
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
encapsulated code DIP DIP DIP DIP DIP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE IN-LINE IN-LINE IN-LINE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 4.32 mm 4.32 mm 4.32 mm 4.32 mm 4.32 mm
speed 8 MHz 12.5 MHz 8 MHz 10 MHz 12.5 MHz
Maximum supply voltage 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V
Minimum supply voltage 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO NO NO
technology NMOS NMOS NMOS NMOS NMOS
Temperature level COMMERCIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL COMMERCIAL
Terminal form THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 2.54 mm 2.54 mm
Terminal location DUAL DUAL DUAL DUAL DUAL
width 22.86 mm 22.86 mm 22.86 mm 22.86 mm 22.86 mm
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR MICROPROCESSOR
Is it Rohs certified? incompatible - incompatible incompatible incompatible
Parts packaging code DIP - DIP DIP DIP
Contacts 64 - 64 64 64
JESD-609 code e0 - e0 e0 e0
Encapsulate equivalent code DIP64,.9 - DIP64,.9 DIP64,.9 DIP64,.9
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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