I4224P datasheet, PDF - EEWORLD Datasheet

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I4224P: DescriptionSpeech Synthesizer With RCDG, 240s, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28; CategoryAnalog mixed-signal IC Consumption circuit; File Size399KB，38 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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I4224P Overview

Speech Synthesizer With RCDG, 240s, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28

I4224P Parametric

Parameter Name	Attribute value
Maker	Winbond Electronics Corporation
Parts packaging code	DIP
package instruction	DIP,
Contacts	28
Reach Compliance Code	unknown
application	CELLULAR PHONE; PORTABLE APPLIANCES
Commercial integrated circuit types	SPEECH SYNTHESIZER WITH RCDG
JESD-30 code	R-PDIP-T28
length	36.83 mm
Number of functions	1
Number of terminals	28
On-chip memory type	FLASH
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Package shape	RECTANGULAR
Package form	IN-LINE
Certification status	Not Qualified
Maximum read time	240 s
Maximum seat height	4.83 mm
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm

I4224P Preview

ISD4002 SERIES

SINGLE-CHIP, MULTIPLE-MESSAGES

VOICE RECORD/PLAYBACK DEVICES

120-, 150-, 180-, AND 240-SECOND DURATION

-1-

Publication Release Date: October 26, 2005

Revision 1.3

ISD4002 SERIES

1. GENERAL DESCRIPTION

The ISD4002 ChipCorder

series provides high-quality, 3-volt, single-chip record/playback solutions

for 2- to 4-minute messaging applications ideally for cellular phones and other portable products. The

CMOS-based devices include an on-chip oscillator, anti-aliasing filter, smoothing filter, AutoMute

feature, audio amplifier, and high density multilevel Flash memory array. The ISD4002 series is

designed to be used in a microprocessor- or microcontroller-based system. Address and control are

accomplished through a Serial Peripheral Interface (SPI) or Microwire Serial Interface to minimize pin

count.

Recordings are stored into the on-chip Flash memory cells, providing zero-power message storage.

This unique single-chip solution utilizes Winbond’s patented multilevel storage technology. Voice and

audio signals are directly stored onto memory array in their natural form, providing high-quality voice

reproduction.

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ISD4002 SERIES

2. FEATURES

•

Single-chip voice record/playback solution

Single 3 volt supply

Low-power consumption

Operating current:

CC_Play

= 15 mA (typical)

CC_Rec

= 25 mA (typical)

CC_Standby

= 1 µA (typical)

Standby current:

•

Single-chip durations of 120, 150, 180, and 240 seconds

High-quality, natural voice/audio reproduction

AutoMute feature provides background noise attenuation

No algorithm development required

Micorcontroller SPI or Microwire™ Serial Interface

Fully addressable to handle multiple messages

Non-volatile message storage

100K record cycles (typical)

100-year message retention (typical)

On-chip clock source

Power consumption controlled by SPI or Microwire control register

Available in die, PDIP, SOIC and TSOP

Packaged types: Leaded and Lead-Free

Temperature:

Commercial (die): 0°C to +50°C

Commercial (packaged units): 0°C to +70°C

Extended (packaged units): -20°C to +70°C

Industrial (packaged units): -40°C to +85°C

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Publication Release Date: October 26, 2005

Revision 1.3

ISD4002 SERIES

3. BLOCK DIAGRAM

Internal Clock

XCLK

Timing

Sampling Clock

ANA IN-

ANA IN+

Amp

5-Pole Active

Antialiasing Filter

Decoders

Analog Transceivers

960K Cell

Nonvolatile

Multilevel Storage

Array

5-Pole Active

Smoothing Filter

AutoMute

Feature

Amp

AUDOUT

Power Conditioning

Device Control

CCA

SSA

SSD

CCD

SCLK

MOSI MISO

INT

RAC

AM CAP

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ISD4002 SERIES

4. TABLE OF CONTENTS

1. GENERAL DESCRIPTION.................................................................................................................. 2

2. FEATURES ......................................................................................................................................... 3

3. BLOCK DIAGRAM .............................................................................................................................. 4

4. TABLE OF CONTENTS ...................................................................................................................... 5

5. PIN CONFIGURATION ....................................................................................................................... 6

6. PIN DESCRIPTION ............................................................................................................................. 7

7. FUNCTIONAL DESCRIPTION.......................................................................................................... 12

7.1. Detailed Description.................................................................................................................... 12

7.2. Serial Peripheral Interface (SPI) Description.............................................................................. 13

7.2.1. OPCODES ........................................................................................................................... 14

7.2.2. SPI Diagrams ....................................................................................................................... 15

7.2.3. SPI Control and Output Registers........................................................................................ 16

8. TIMING DIAGRAMS.......................................................................................................................... 18

9. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 20

9.1. Operating Conditions .................................................................................................................. 21

10. ELECTRICAL CHARACTERISTICS ............................................................................................... 22

10.1. Parameters For Packaged Parts .............................................................................................. 22

10.2. Parameters For Die .................................................................................................................. 25

10.3. SPI AC Parameters .................................................................................................................. 26

11. TYPICAL APPLICATION CIRCUIT ................................................................................................. 27

12. PACKAGING AND DIE INFORMATION ......................................................................................... 30

12.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC)..................................................................... 30

12.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................... 31

12.3. 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 - IQC ...................... 32

12.4. 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 ................................ 33

12.5. Die Information ......................................................................................................................... 34

13. ORDERING INFORMATION........................................................................................................... 36

14. VERSION HISTORY ....................................................................................................................... 37

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Publication Release Date: October 26, 2005

Revision 1.3

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