1 A, 300 V, SILICON, SIGNAL DIODE, DO-214AC

| ES1E | ES1A | ES1C | ES1J | ES1B | ES1D | ES1G | |
|---|---|---|---|---|---|---|---|
| Description | 1 A, 300 V, SILICON, SIGNAL DIODE, DO-214AC | 1 A, 50 V, SILICON, SIGNAL DIODE | 1 A, 150 V, SILICON, SIGNAL DIODE, DO-214AC | 1 A, 600 V, SILICON, SIGNAL DIODE, DO-214AC | 1 A, 100 V, SILICON, SIGNAL DIODE, DO-214AC | 1 A, 200 V, SILICON, SIGNAL DIODE | 1 A, 400 V, SILICON, SIGNAL DIODE, DO-214AC |
| Number of terminals | - | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of components | - | 1 | 1 | 1 | 1 | 1 | 1 |
| Processing package description | - | Plastic, SMA, 2 PIN | SMA, 2 PIN | SMA, 2 PIN | GREEN, PLASTIC, SMA, 2 PIN | Plastic, SMA, 2 PIN | Plastic, HSMA, 2 PIN |
| state | - | ACTIVE | ACTIVE | TRANSFERRED | ACTIVE | ACTIVE | DISCONTINUED |
| packaging shape | - | Rectangle | RECTANGULAR | Rectangle | Rectangle | Rectangle | Rectangle |
| Package Size | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| surface mount | - | Yes | Yes | Yes | Yes | Yes | Yes |
| Terminal form | - | C BEND | C BEND | C BEND | C BEND | C BEND | C BEND |
| Terminal location | - | pair | DUAL | pair | pair | pair | pair |
| Packaging Materials | - | Plastic/Epoxy | PLASTIC/EPOXY | Plastic/Epoxy | Plastic/Epoxy | Plastic/Epoxy | Plastic/Epoxy |
| structure | - | single | SINGLE | single | single | single | single |
| Diode component materials | - | silicon | SILICON | silicon | silicon | silicon | silicon |
| Diode type | - | Signal diode | SIGNAL DIODE | Signal diode | Signal diode | Signal diode | Signal diode |
| Maximum reverse recovery time | - | 0.0200 us | 0.0150 us | 0.0600 us | 0.0350 us | 0.0200 us | 0.0600 us |
| Maximum repetitive peak reverse voltage | - | 50 V | 150 V | 600 V | 100 V | 200 V | 400 V |
| Maximum average forward current | - | 1 A | 1 A | 1 A | 1 A | 1 A | 1 A |
| terminal coating | - | - | MATTE TIN | NOT SPECIFIED | PURE Tin | PURE Tin | tin lead |