74LS395FCQM datasheet, PDF - EEWORLD Datasheet

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74LS395FCQM: DescriptionShift Register, 4-Bit, TTL, CDFP16,; Categorylogic logic; File Size190KB，5 Pages; ManufacturerFairchild; Websitehttp://www.fairchildsemi.com/

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74LS395FCQM Overview

Shift Register, 4-Bit, TTL, CDFP16,

74LS395FCQM Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Fairchild
package instruction	DFP, FL16,.3
Reach Compliance Code	compliant
JESD-30 code	R-XDFP-F16
JESD-609 code	e0
Humidity sensitivity level	2A
Number of digits	4
Number of functions	1
Number of terminals	16
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	CERAMIC
encapsulated code	DFP
Encapsulate equivalent code	FL16,.3
Package shape	RECTANGULAR
Package form	FLATPACK
Peak Reflow Temperature (Celsius)	250
power supply	5 V
Certification status	Not Qualified
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	30

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74LS395FCQM Related Products

	74LS395FCQM	54LS395L1MQB	54LS395FMQB	54LS395DMQB	74LS395DCQR	74LS395DCQM
Description	Shift Register, 4-Bit, TTL, CDFP16,	Shift Register, 4-Bit, TTL, CQCC20,	Shift Register, 4-Bit, Right Direction, TTL, CDFP16,	Shift Register, 4-Bit, Right Direction, TTL, CDIP16,	Shift Register, 4-Bit, TTL, CDIP16,	Shift Register, 4-Bit, TTL, CDIP16,
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Fairchild	Fairchild	Fairchild	Fairchild	Fairchild	Fairchild
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
JESD-30 code	R-XDFP-F16	S-XQCC-N20	R-XDFP-F16	R-XDIP-T16	R-XDIP-T16	R-XDIP-T16
JESD-609 code	e0	e0	e0	e0	e0	e0
Number of digits	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1
Number of terminals	16	20	16	16	16	16
Maximum operating temperature	70 °C	125 °C	125 °C	125 °C	70 °C	70 °C
Package body material	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
encapsulated code	DFP	QCCN	DFP	DIP	DIP	DIP
Encapsulate equivalent code	FL16,.3	LCC20,.35SQ	FL16,.3	DIP16,.3	DIP16,.3	DIP16,.3
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	CHIP CARRIER	FLATPACK	IN-LINE	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	NO	NO	NO
technology	TTL	TTL	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	FLAT	NO LEAD	FLAT	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	QUAD	DUAL	DUAL	DUAL	DUAL
Is it lead-free?	Contains lead	Contains lead	-	-	Contains lead	Contains lead
package instruction	DFP, FL16,.3	QCCN, LCC20,.35SQ	-	-	DIP, DIP16,.3	DIP, DIP16,.3
Humidity sensitivity level	2A	2A	-	-	2A	2A
Peak Reflow Temperature (Celsius)	250	250	-	-	250	250
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified
Maximum time at peak reflow temperature	30	30	-	-	30	30

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