IC IC,FLIP-FLOP,HEX,D TYPE,ACT-CMOS,DIP,20PIN,CERAMIC, FF/Latch
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP20,.3 |
| Reach Compliance Code | not_compliant |
| JESD-30 code | R-XDIP-T20 |
| Logic integrated circuit type | D FLIP-FLOP |
| Number of functions | 6 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP20,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Trigger type | POSITIVE EDGE |
| 54ACT11378J | RCWP02018K45FMTP | SNJ54ACT11378J | 74ACT11378J | |
|---|---|---|---|---|
| Description | IC IC,FLIP-FLOP,HEX,D TYPE,ACT-CMOS,DIP,20PIN,CERAMIC, FF/Latch | RESISTOR, METAL GLAZE/THICK FILM, 0.05 W, 1 %, 300 ppm, 8450 ohm, SURFACE MOUNT, 0201, CHIP | IC,FLIP-FLOP,HEX,D TYPE,ACT-CMOS,DIP,20PIN,CERAMIC | IC,FLIP-FLOP,HEX,D TYPE,ACT-CMOS,DIP,20PIN,CERAMIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP20,.3 | SMT, 0201 | DIP, DIP20,.3 | DIP, DIP20,.3 |
| Reach Compliance Code | not_compliant | compliant | not_compliant | not_compliant |
| Number of terminals | 20 | 2 | 20 | 20 |
| Maximum operating temperature | 125 °C | 150 °C | 125 °C | 85 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -40 °C |
| Package shape | RECTANGULAR | RECTANGULAR PACKAGE | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMT | IN-LINE | IN-LINE |
| surface mount | NO | YES | NO | NO |
| technology | CMOS | METAL GLAZE/THICK FILM | CMOS | CMOS |
| Maker | Texas Instruments | - | Texas Instruments | Texas Instruments |
| JESD-30 code | R-XDIP-T20 | - | R-XDIP-T20 | R-XDIP-T20 |
| Logic integrated circuit type | D FLIP-FLOP | - | D FLIP-FLOP | D FLIP-FLOP |
| Number of functions | 6 | - | 6 | 6 |
| Package body material | CERAMIC | - | CERAMIC | CERAMIC |
| encapsulated code | DIP | - | DIP | DIP |
| Encapsulate equivalent code | DIP20,.3 | - | DIP20,.3 | DIP20,.3 |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | - | 5 V | 5 V |
| Certification status | Not Qualified | - | Not Qualified | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V | - | 5 V | 5 V |
| Temperature level | MILITARY | - | MILITARY | INDUSTRIAL |
| Terminal form | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | - | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | - | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| Trigger type | POSITIVE EDGE | - | POSITIVE EDGE | POSITIVE EDGE |