MC74AC4040
12 Stage Binary Ripple Counter
The MC74AC4040 consists of 12 master-slave flip-flops. The output of each
flip-flop feeds the next and the frequency at each output is half that of the preceding
one. The state of the counter advances on the negative-going edge of the Clock
input. Reset is asynchronous and active-high.
State changes of the Q outputs do not occur simultaneously because of internal
ripple delays. Therefore, decoded output signals are subject to decoding spikes
and may have to be gated with the Clock of the MC74AC4040 for some designs.
•
•
•
•
140 MHz Typ. Clock
Outputs Source/Sink 24 mA
Operating Voltage Range: 2.0 to 6.0 V
High Noise Immunity
VCC
16
Q11
15
Q10
14
Q8
13
Q9
12
RESET CLK
11
10
Q1
9
12-STAGE
BINARY RIPPLE
COUNTER
N SUFFIX
CASE 648-08
PLASTIC
1
Q12
2
Q6
3
Q5
4
Q7
5
Q4
6
Q3
7
Q2
8
GND
D SUFFIX
CASE 751B-05
PLASTIC
FUNCTION TABLE
Clock
Reset
L
L
X
H
Output State
No Change
Advance to next state
All Outputs are low
CLOCK
LOGIC DIAGRAM
9
7
6
5
10
3
2
4
13
12
14
15
1
11
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q8
Q9
Q10
Q11
Q12
RESET
PIN 16 = VCC
PIN 8 = GND
FACT DATA
5-1
MC74AC4040
MAXIMUM RATINGS*
Symbol
VCC
Vin
Vout
Iin
Iout
ICC
PD
Parameter
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
DC Output Current, per Pin
DC VCC or GND Current per Output Pin
Power Dissipation in Still Air
Plastic**
SOIC Package**
Storage Temperature
Lead Temperature, 1 mm from Case for 10 seconds
(Plastic DIP or SOIC Package)
Value
–0.5 to +7.0
–0.5 to VCC +0.5
–0.5 to VCC +0.5
±20
±50
±50
750
500
–65 to +150
260
°C
°C
Unit
V
V
V
mA
mA
mA
mW
Tstg
TL
* Maximum Ratings are those values beyond which damage to the device may occur.
** Derating: Plastic DIP: – 10mW/°C from 65°C to 125°C
SOIC Package: –7.0 mW/°C from 65°C to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Vin/Vout
TA
tr/tf
Parameter
DC Supply Voltage (Referenced to GND)
Input Voltage, Output Voltage (Ref. to GND)
Operating Temperature, All Package Types
Input Rise/Fall Time
(Figure 1)
VCC = 3.0 V
VCC = 4.5 V
VCC = 5.5 V
Min
2.0
0
–40
0
0
0
Max
6.0
VCC
+85
150
40
25
°C
ns/V
Unit
V
FACT DATA
5-2
MC74AC4040
OUTLINE DIMENSIONS
N SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
9
–A–
16
B
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
S
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0
_
10
_
0.020
0.040
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0
_
10
_
0.51
1.01
F
S
C
L
–T–
H
G
D
16 PL
SEATING
PLANE
K
J
T A
M
M
0.25 (0.010)
M
–A–
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
9
16
–B–
1
8
P
8 PL
0.25 (0.010)
M
B
S
G
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0
_
7
_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0
_
7
_
0.229
0.244
0.010
0.019
K
C
–T–
SEATING
PLANE
R
X 45
_
M
D
16 PL
M
J
0.25 (0.010)
T B
S
A
S
DIM
A
B
C
D
F
G
J
K
M
P
R
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◊
FACT DATA
5-5
*MC74AC4040/D*
MC74AC4040/D
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