datasheet
EEWORLDEEWORLDEEWORLD
Datasheet
Part Number

Keyword

Search
Keyword

Part Number

Search
Datasheet> All Categories > semiconductor> Discrete semiconductor> 2DD2679-13
PDF
Preview

2DD2679-13

Description
2000 mA, 30 V, NPN, Si, SMALL SIGNAL TRANSISTOR
Categorysemiconductor    Discrete semiconductor   
File Size104KB，4 Pages
ManufacturerDiodes
Websitehttp://www.diodes.com/
Download Datasheet Parametric Compare View All

2DD2679-13 Online Shopping

Suppliers Part Number Price MOQ In stock  
2DD2679-13 - - View Buy Now

2DD2679-13 Overview

2000 mA, 30 V, NPN, Si, SMALL SIGNAL TRANSISTOR

2DD2679-13 Parametric

Parameter NameAttribute value
Number of terminals3
Transistor polarityNPN
Maximum collector current2 A
Maximum Collector-Emitter Voltage30 V
Processing package descriptionGREEN, PLASTIC PACKAGE-3
Lead-freeYes
EU RoHS regulationsYes
China RoHS regulationsYes
stateACTIVE
packaging shapeRECTANGULAR
Package SizeSMALL OUTLINE
surface mountYes
Terminal formFLAT
terminal coatingMATTE TIN
Terminal locationSINGLE
Packaging MaterialsPLASTIC/EPOXY
structureSINGLE
Shell connectionCOLLECTOR
Number of components1
transistor applicationsSWITCHING
Transistor component materialsSILICON
Transistor typeGENERAL PURPOSE SMALL SIGNAL
Minimum DC amplification factor270
Rated crossover frequency240 MHz

Preview

Download Datasheet
2DD2679
LOW V
CE(SAT)
NPN SURFACE MOUNT TRANSISTOR
Please click here to visit our online spice models database.
Features
•
•
•
•
•
•
Epitaxial Planar Die Construction
Ideally Suited for Automated Assembly Processes
Ideal for Medium Power Switching or Amplification Applications
Complementary PNP Type (2DB1714) Available
Lead Free By Design/RoHS Compliant (Note 1)
"Green" Device (Note 2)
Mechanical Data
•
•
•
•
•
•
•
Case: SOT89-3L
Case Material: Molded Plastic, "Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Finish — Matte Tin annealed over Copper leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Marking Information: See Page 4
Ordering Information: See Page 4
Weight: 0.072 grams (approximate)
NEW PRODUCT
COLLECTOR
2,4
3 E
C 4
2 C
1 B
TOP VIEW
Pin Out Configuration
1
BASE
3
EMITTER
Top View
Device Schematic
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Symbol
V
CBO
V
CEO
V
EBO
I
CM
I
C
Value
30
30
6
4
2
Unit
V
V
V
A
A
Characteristic
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Peak Pulse Current
Continuous Collector Current
Thermal Characteristics
Characteristic
Power Dissipation (Note 3) @ T
A
= 25°C
Thermal Resistance, Junction to Ambient Air (Note 3) @ T
A
= 25°C
Power Dissipation (Note 4) @ T
A
= 25°C
Thermal Resistance, Junction to Ambient Air (Note 4) @ T
A
= 25°C
Operating and Storage Temperature Range
Symbol
P
D
R
θ
JA
P
D
R
θ
JA
T
J
, T
STG
Value
0.9
139
2
62.5
-55 to +150
Unit
W
°C/W
W
°C/W
°C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Symbol
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
I
CBO
I
EBO
V
CE(SAT)
h
FE
C
obo
f
T
Min
30
30
6
⎯
⎯
⎯
270
⎯
⎯
Typ
⎯
⎯
⎯
⎯
⎯
80
⎯
11
240
Max
⎯
⎯
⎯
0.1
0.1
370
680
⎯
⎯
Unit
V
V
V
μA
μA
mV
⎯
pF
MHz
Conditions
I
C
= 10μA, I
E
= 0
I
C
= 1mA, I
B
= 0
I
E
= 10μA, I
C
= 0
V
CB
= 30V, I
E
= 0
V
EB
= 6V, I
C
= 0
I
C
= 1.5A, I
B
= 75mA
V
CE
= 2V, I
C
= 200mA
V
CB
= 10V, I
E
= 0,
f = 1MHz
V
CE
= 2V, I
C
= 100mA,
f = 100MHz
Characteristic
OFF CHARACTERISTICS
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage (Note 5)
Emitter-Base Breakdown Voltage
Collector Cut-Off Current
Emitter Cut-Off Current
ON CHARACTERISTICS (Note 5)
Collector-Emitter Saturation Voltage
DC Current Gain
SMALL SIGNAL CHARACTERISTICS
Output Capacitance
Current Gain-Bandwidth Product
Notes:
1.
2.
3.
4.
5.
No purposefully added lead.
Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
Device mounted on FR-4 PCB with minimum recommended pad layout.
Device mounted on FR-4 PCB with 1 inch
2
Copper pad layout.
Measured under pulsed conditions. Pulse width = 300μs. Duty cycle
≤2%.
2DD2679
Document number: DS31629 Rev. 2 - 2
1 of 4
www.diodes.com
December 2008
© Diodes Incorporated

2DD2679-13 Related Products

2DD2679-13 2DD2679
Description 2000 mA, 30 V, NPN, Si, SMALL SIGNAL TRANSISTOR 2000 mA, 30 V, NPN, Si, SMALL SIGNAL TRANSISTOR
Number of terminals 3 3
Transistor polarity NPN NPN
Maximum collector current 2 A 2 A
Maximum Collector-Emitter Voltage 30 V 30 V
Processing package description GREEN, PLASTIC PACKAGE-3 GREEN, PLASTIC PACKAGE-3
Lead-free Yes Yes
EU RoHS regulations Yes Yes
China RoHS regulations Yes Yes
state ACTIVE ACTIVE
packaging shape RECTANGULAR RECTANGULAR
Package Size SMALL OUTLINE SMALL OUTLINE
surface mount Yes Yes
Terminal form FLAT FLAT
terminal coating MATTE TIN MATTE TIN
Terminal location SINGLE SINGLE
Packaging Materials PLASTIC/EPOXY PLASTIC/EPOXY
structure SINGLE SINGLE
Shell connection COLLECTOR COLLECTOR
Number of components 1 1
transistor applications SWITCHING SWITCHING
Transistor component materials SILICON SILICON
Transistor type GENERAL PURPOSE SMALL SIGNAL GENERAL PURPOSE SMALL SIGNAL
Minimum DC amplification factor 270 270
Rated crossover frequency 240 MHz 240 MHz

Recommended Resources

AD596-597 functional diagram

Stereo FM Demodulator Circuit

Reverse music running light circuit

Amplitude modulation circuit using three transistors

TV standard color generator

LA1265 power amplifier circuit

Can a WinCE-based mobile phone with BSP replace the functions of the development board?
The original wince6 system of the phone, I don't need to expand any functions of the phone's hardware, and I have the BSP program of this phone, I just want to replace it with my own customized wince6...
baby110 Embedded System
Processor SDK for C6748 processors with TI-RTOS support
DescriptionThe Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors that is easy to set up and provides out-of-the-box benchmarks and demos. All versions ...
灞波儿奔 DSP and ARM Processors
Wireless systems are not secure (7) – what should we worry about?
[b][u][size=16px][color=#033660]Myth #6: Wireless systems can’t be used for control[/color][/size][/u][/b] [size=16px]Some control applications require updates every few milliseconds. This is not prac...
小瑞 RF/Wirelessly
Advice for "Flower Guardians"
Thank you for your hard work, flower protector. Your post is good. Here is a small suggestion for you. You can combine these articles into one article, or compress them into one document and upload th...
ys3663391 FPGA/CPLD
EEWORLD University Hall----Live Replay: Maxim supports integrated digital IO technology for industrial systems
Live Replay: Maxim Integrated Digital IO Technology Supporting Industrial Systems : https://training.eeworld.com.cn/course/6077...
hi5 Integrated technical exchanges
[Nucleo Experience] + FM1702SL as a contactless IC card reader
Development environment and debugging tools are ready. Let's start to test an application. Based on FM1702SL, we make a contactless IC card reader. We used GPIO to simulate the SPI interface, and the ...
gxliu08 stm32/stm8
Shortcut:   A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components

  1. AME8500CEEVCE18
  2. FREQ392SMX/10/100/-10+70/10pF
  3. QS54FCT646ATLB
  4. LP24-SR-FREQ2-15F1KJ
  5. 8P008SRV1405C15
  6. P1-12139W
  7. RCWP050210K5FKEA
  8. TW-24-03-S-Q-120-085
  9. SA8.0C
  10. ER1001A_T0_10001
  11. C4201WR-F-2x1P-GWT-BK
  12. A2543WVA-9P-BK-G30

Popular Articles

  1. Realme Xu Qi: Realme GT2 series industry's first material technology, exploring environmentally friendly design
  2. The composition of the megohmmeter
  3. Samsung Galaxy S22 series HD wallpapers leaked in advance
  4. The new generation of Snapdragon 8 mobile platform helps Honor Magic V usher in the era of foldable screen flagship phones
  5. Huawei Mate 50 may be released in June: the first to be equipped with the official version of Hongmeng 3.0 system
  6. BlackBerry phones are deactivated and appear on CCTV!
  7. How to solve the coating uniformity problem of lithium iron phosphate batteries?
  8. Wei Dongshan ARM bare metal learning notes - code relocation
  9. Mobileye's self-driving cars are now fully equipped with true redundant sensor systems
  10. Experience in controlling fan operation based on 51 microcontroller Bluetooth module

Technical ResourceMore

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

About Us Customer Service Contact Information Datasheet Sitemap LatestNews
Index Files: 2564  478  239  223  1084  52  10  5  22  25 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号