DC/DC converter IC for camera module for car navigation system
BD8671KN
Fig. - 2
・+3.3V
output Step down DC/DC converter for asynchronous rectification system
・+12V
output Boost DC/DC converter for asynchronous rectification system
・-5V
output Voltage control charge pump for reversing type for negative voltage
・Soft
start function
・Building
in low voltage and over voltage protection function
・Building
in terminal RT OPEN/Short protection
・The
frequency can be set by external resistance
・Concentrated
protection control with built-in sequencer
・VQFN-28
package
◎ABSOLUTE
MAXIMUM RATING:（Ta=25℃）
Parameter
VIN supply voltage
PVIN supply voltage
Input terminal voltage 1
*1
Input terminal voltage 2
*2
Input terminal voltage 3
*3
Input terminal voltage 4
*4
Output terminal voltage 1
*5
Output terminal voltage 2
*6
Output terminal voltage 3
*7
Output terminal voltage 4
*8
Output terminal voltage 5
*9
Power dissipation
Operating temperature
Storage temperature
*1
*4
*8
*10
*11
Symbol
VIN
PVIN
VIN1
VIN2
VIN3
VIN4
VOUT1
VOUT2
VOUT3
VOUT4
VOUT5
Pd
Topr
Tstg
-0.3
-0.3
-0.3
-0.3
-0.3
-10.0
-0.3
-0.3
-0.3
-0.3
VIN4
-40
-55
Limits
½
½
½
½
½
½
½
½
½
½
½
0.725
*11
½
½
+18.0
VIN
VIN
+20.0
+20.0
+0.3
VIN
PVIN
+20.0
VIN3
*10
+0.3
+85
+150
Unit
V
V
V
V
V
V
V
V
V
V
V
W
℃
℃
FB12、SS12、TEST1、TEST2、TEST3、RT、CTL1、CTL2、CTL3、SS33、V33 terminal voltage *2 V12 terminal voltage *3 V12IN terminal voltage
MV8 terminal voltage *5 FC12 terminal voltage *6 SW33 terminal voltage *7 SW12 terminal voltage
V8、CP terminal voltage
*9 MV5、CM terminal voltage
V8 terminal voltage ABSOLUTE MAXIMUM RATING is VIN3 or 10V is low. Between V8 terminal voltage and MV5 terminal voltage ABSOLUTE MAXIMUM RATING is 15V.
70mm×70mm, thickness1.6mm, less than 3% share of copper foil when implementing glass epoxy board.
Operating at higher than Ta=25℃, 5.8mW shall be reduced per 1
◎OPERATION
CONDITION
Parameter
(Please set the power-supply voltage in consideration of a power dissipation.)
Symbol
MIN
4.5
TYP
6.0
MAX
9.0
Unit
V
VIN supply voltage
VIN
This product is not designed for protection against radioactive rays.
H->L (ON->OFF) control, When CTL3=L. (Refer to NOTE ON USE-13)
◎PACKAGE
OUTLINE
◎BLOCK
DIAGRAM
VIN
Product number
V12IN
VREG
BG
D8671
V8
OVP
LVP
PON
PVIN
1pin mark
LOT No.
V8IN
OSC
CP
PGNDM8
Charge
Pump
Cntorol
OSC
D
R
V
SW33
V33
PON,LVP,OVP
SEQUENCER
PGND33
CM
MV8
SS33
V33
MV8IN
PGND12
MV5
PON,LVP,OVP
D
R
V
SW12
MV5
OSC
TSD
CTL1
CTL2
CTL3
BG
FC12
FB12
VQFN-28
（
UNIT
：mm）
RT
OSC
OSC
V12
PON,LVP,OVP
SS12
V12
TSD
TEST3 TEST2 TEST1
GND SGND
Fig.-１ PACKAGE OUTLINE
Fig.-2.BLOCK DIAGRAM
REV. A
4/4
◎NOTE
ON USE
1．About the absolute maximum rating
Attention is brushed off enough to the quality control, it is likely to destroy when the absolute maximum rating such as impressed voltages (VCC_IN,DCIN) and
ranges (Topr) of the operating temperature as it is exceeded, the mode of breakings of the short or the opening, etc. cannot be specified, and examine it in this
IC to give physical measures for safety such as fuses when a special mode that exceeds the absolute maximum rating is assumed.
2．About the reverse-connection of the power supply connector
IC might destroy it by reversely connecting the power supply connector. Give measures such as putting the diode between power supply terminals of power
supply and IC outside for the reverse-touching destruction protection.
3．Power supply line
Please do measures such as putting the bypass capacitor in power supply-GND nearest pin of this IC as the route of the resurrection current to cause the
return of the current in which it resurrected it by the counter electromotive force of the coil.
Please confirm the characteristic of the electrolytic capacitor enough as the capacity omission etc. at the low temperature never happen, and decide it.
4．About grand potential
Any state of operation must become the lowest potential about the potential of the terminal GND. Moreover, confirm whether there is terminal that is actually the
voltage of GND or less including transients.
5．About the heat design
Think about permissible loss (Pd) in an actual state of use, and do the heat design with the margin enough.
6．About the short and the miss-installation between terminals
Note the direction and the miss-registration of IC enough when you install it in the set substrate. IC might destroy it as well as reversely connecting the power
supply connector when installing it by mistake. Moreover, there is fear of destruction when the foreign body enters between terminals, the terminal, the power
supply, and grandeur and it is short-circuited.
7．About operation in strong electromagnetic field
In use in strong electromagnetic field, note that there is a possibility of malfunctioning.
8．About the capacitor during output-GND
The current charged the capacitor with when VCC is 0V or is GND and is short-circuited when a big capacitor is connected between GND output by some
factors flows into the output and it is likely to destroy it. Give the capacitor between GND output to 0.1μF or less.
9．About the inspection by the set substrate
It is likely to suffer stress to IC and discharge electricity every one process when you connect the capacitor with the pin with low impedance when inspecting it in
the set substrate. Moreover, detach it after connecting after the power supply is turned off without fail when detaching it to G in the inspection process,
inspecting, and turning off the power supply. n addition, be give the earth to the assembly process as a static electricity measures, and careful enough when it
transports and you preserve it.
10．About each input terminal
+
This IC is a monolithic IC which has a P isolations and P substrate to isolate elements each other.
This P layer and an N layer in each element form a PN junction to construct various parasitic elements.
For instance, the potential difference operates in resistance as shown in the figure below when resistance and the transistor connect it with the terminal and the
playground (GND) >(terminal B) joint of PN operates as a parasitic diode in playground (GND) >(terminal A) transistor (NPN). In addition, the NPN transistor of
parasitism works with N layer of the element of the above-mentioned parasitic diode and the neighborhood and others in transistor (NPN). A parasitic element
in IC composition is inevitably formed because of the potential relation.
A parasitic element can operate, the interference with the circuit operation be caused, it malfunction, and, consequently, it cause destruction. Therefore, do not
do the usage that a parasitic element operates as a voltage that is lower than the playground (GND;P substrate) is impressed to the input terminal enough.
Moreover, do not impress the voltage to the input terminal when you do not impress the power-supply voltage to IC. Give each input terminal to me the voltage
below the power-supply voltage or in the guarantee value of an electric characteristic when you similarly impress the power-supply voltage.
Example of IC of simple structure
11．Earth wiring pattern
If small signal GND and large current GND exist, disperse their pattern. In addition, for voltage change by pattern wiring impedance and large current not to
change voltage of small signal GND, each ground terminal of IC must be connected at the one point on the set circuit board. As for GND of external parts, it is
similar to the above-mentioned.
12．Thermal Shut-Down
When a thermal shutdown operates, the DC/DC converter controller of all Ch is turned off. When a thermal shutdown is released, the DC/DC converter
controller of all Ch becomes an operation beginning from turning off.
13．DC/DC converter control terminal (CTL1,2,3)
This IC has 3 output voltage (3.3V,12.0V,-5.0V). When you turning off control 12.0V output from all output ON(CTL1,2,3=H) time with the terminal CTL2,
please control 12.0V output turning off with the terminal CTL2 after 200μs or more has passed by the terminal CTL3 since -5.0 the V output was turning off
controlled.
REV. A
Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, commu-
nication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
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