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P0402FC12C-T75-1-LF

Description
Trans Voltage Suppressor Diode, 250W, 12V V(RWM), Bidirectional, 1 Element, Silicon, ROHS AND REACH COMPLIANT, FLIP CHIP-4
CategoryDiscrete semiconductor    diode   
File Size803KB,9 Pages
ManufacturerProTek Devices
Websitehttp://www.protekdevices.com/
Download Datasheet Parametric View All

P0402FC12C-T75-1-LF Overview

Trans Voltage Suppressor Diode, 250W, 12V V(RWM), Bidirectional, 1 Element, Silicon, ROHS AND REACH COMPLIANT, FLIP CHIP-4

P0402FC12C-T75-1-LF Parametric

Parameter NameAttribute value
MakerProTek Devices
Parts packaging codeFLIP-CHIP
package instructionR-PBGA-B4
Contacts4
Reach Compliance Codecompliant
ECCN codeEAR99
Minimum breakdown voltage13.3 V
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 codeR-PBGA-B4
JESD-609 codee1
Maximum non-repetitive peak reverse power dissipation250 W
Number of components1
Number of terminals4
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formGRID ARRAY
polarityBIDIRECTIONAL
Maximum repetitive peak reverse voltage12 V
surface mountYES
technologyAVALANCHE
Terminal surfaceTIN SILVER COPPER
Terminal formBALL
Terminal locationBOTTOM
05107
Only One Name Means ProTek’Tion™
P0402FC3.3C - P0402FC36C
250w FliP ChiP tvs aRRay
DesCRiPtion
The P0402FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level
transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed
specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These
devices are ideally suited for handheld devices, PCMCIA and SMART cards.
This series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 250 Watts per
line for an 8/20µs waveform. In addition, the P0402FCxxC series features superior clamping performance, low leak-
age current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates
overshoot voltage due to package inductance.
0402 PaCkage
FeatuRes
Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV
Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns
ESD Protection > 25 kilovolts
Available in Voltages Ranging from 3.3V to 36V
250 Watts Peak Pulse Power per Line (tp = 8/20µs)
Protection for 1 Line
RoHS Compliant
REACH Compliant
aPPliCations
Cellular Phones
MCM Boards
Wireless Communication Circuits
IR LEDs
SMART & PCMCIA Cards
MeChaniCal ChaRaCteRistiCs
Standard EIA Chip Size: 0402
Approximate Weight: 0.73 milligrams
Lead-Free Plating
Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
Flammability Rating UL 94V-0
8mm Tape per EIA Standard 481
Top Contacts: Solder Bump 0.004” in Height (Nominal)
CiRCuit DiagRaM
Pin 1
Pin 2
1 line of Protection
05107.R12 8/10
Page 1
www.protekdevices.com
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