Loadable PLD, CMOS, PBGA600, HEAT SINK, BGA-600
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Altera (Intel) |
| Parts packaging code | BGA |
| package instruction | HBGA, BGA600,35X35,50 |
| Contacts | 600 |
| Reach Compliance Code | compliant |
| JESD-30 code | S-PBGA-B600 |
| JESD-609 code | e0 |
| length | 45 mm |
| Dedicated input times | 4 |
| Number of I/O lines | 470 |
| Number of entries | 470 |
| Number of logical units | 12160 |
| Output times | 470 |
| Number of terminals | 600 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 4 DEDICATED INPUTS, 470 I/O |
| Output function | MIXED |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | HBGA |
| Encapsulate equivalent code | BGA600,35X35,50 |
| Package shape | SQUARE |
| Package form | GRID ARRAY, HEAT SINK/SLUG |
| Peak Reflow Temperature (Celsius) | 220 |
| power supply | 2.5,2.5/3.3 V |
| Programmable logic type | LOADABLE PLD |
| Certification status | Not Qualified |
| Maximum seat height | 1.93 mm |
| Maximum supply voltage | 2.7 V |
| Minimum supply voltage | 2.3 V |
| Nominal supply voltage | 2.5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | BALL |
| Terminal pitch | 1.27 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 45 mm |
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