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P4C168-35DMB

Description
Standard SRAM, 4KX4, 35ns, CMOS, CDIP20, 0.300 INCH, CERAMCI, DIP-20
Categorystorage    storage   
File Size75KB,8 Pages
ManufacturerPyramid Semiconductor Corporation
Websitehttp://www.pyramidsemiconductor.com/
Download Datasheet Parametric View All

P4C168-35DMB Overview

Standard SRAM, 4KX4, 35ns, CMOS, CDIP20, 0.300 INCH, CERAMCI, DIP-20

P4C168-35DMB Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerPyramid Semiconductor Corporation
Parts packaging codeDIP
package instructionDIP,
Contacts20
Reach Compliance Codecompliant
ECCN code3A001.A.2.C
Maximum access time35 ns
JESD-30 codeR-CDIP-T20
JESD-609 codee0
memory density16384 bit
Memory IC TypeSTANDARD SRAM
memory width4
Number of functions1
Number of terminals20
word count4096 words
character code4000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize4KX4
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeDIP
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Filter levelMIL-STD-883 Class B
Maximum seat height5.08 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTIN LEAD
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm
P4C168, P4C169, P4C170
P4C168, P4C169, P4C170
ULTRA HIGH SPEED 4K x 4
STATIC CMOS RAMS
FEATURES
Full CMOS, 6T Cell
High Speed (Equal Access and Cycle Times)
– 12/15/20/25ns (Commercial)
– 20/25/35ns (P4C168 Military)
Low Power Operation (Commercial)
– 715 mW Active
– 193 mW Standby (TTL Input) P4C168
– 83 mW Standby (CMOS Input) P4C168
Single 5V
±
10% Power Supply
Fully TTL Compatible, Common I/O Ports
Three Options
– P4C168 Low Power Standby Mode
– P4C169 Fast Chip Select Control
– P4C170 Fast Chip Select, Output Enable
Controls
Standard Pinout (JEDEC Approved)
– P4C168: 20-pin DIP, SOJ and SOIC
– P4C169: 20-pin DIP and SOIC
– P4C170: 22-pin DIP
DESCRIPTION
The P4C168, P4C169 and P4C170 are a family of 16,384-
bit ultra high-speed static RAMs organized as 4K x 4. All
three devices have common input/output ports.The
P4C168 enters the standby mode when the chip enable
(CE) control goes high; with CMOS input levels, power
consumption is only 83mW in this mode. Both the P4C169
and the P4C170 offer a fast chip select access time that is
only 67% of the address access time. In addition, the
P4C170 includes an output enable (OE) control to elimi-
nate data bus contention. The RAMs operate from a single
5V
±
10% tolerance power supply.
Access times as fast as 12 nanoseconds are available,
permitting greatly enhanced system operating speeds.
CMOS is used to reduce power consumption to a low 715
mW active, 193 mW standby.
The P4C168 and P4C169 are available in 20-pin (P4C170
in 22-pin) 300 mil DIP packages providing excellent board
level densities. The P4C168 is also available in 20-pin 300
mil SOIC and SOJ packages.
The P4C169 is also available in a 20-pin 300 mil SOIC
package. The P4C170 is also available in a 22-pin 300 mil
SOJ package.
FUNCTIONAL BLOCK DIAGRAM
A
ROW
SELECT
A
16,384-BIT
MEMORY
ARRAY
PIN CONFIGURATIONS
(7)
A
0
A
1
A
2
INPUT
DATA
CONTROL
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
V
CC
A
11
A
10
A
9
A
8
I/O
4
I/O
3
I/O
2
I/O
1
WE
A
0
A
1
A
2
A
3
A
4
A
5
A
6
A
7
CS
OE
GND
1
2
3
4
5
6
7
8
9
10
11
22
21
20
19
18
17
16
15
14
13
12
V
CC
A
11
A
10
A
9
A
8
NC
I/O
4
I/O
3
I/O
2
I/O
1
WE
I/O
1
I/O
2
I/O
3
I/O
4
COLUMN I/O
A
3
A
4
A
5
A
6
A
7
CE, CS
GND
POWER
DOWN
COLUMN
SELECT
CE or CS
WE
OE
NOTES:
CE
USED ON P4C168 ALSO FOR POWER DOWN FUNCTIONS
CE
USED ON P4C169 FAST CHIP SELECT
OE
OUTPUT ENABLE FUNCTION ON P4C170 ONLY
P4C168
ONLY
A
(5)
A
P4C168
P4C169
DIP (P2, D2) DIP (P2)
SOIC (S2)
SOIC (S2)
SOJ (J2)
TOP VIEW
P4C170
DIP (P3)
TOP VIEW
Means Quality, Service and Speed
1Q97
33

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