MT4LC16M4A7TG-5S datasheet, PDF

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MT4LC16M4A7TG-5S: DescriptionFast Page DRAM, 16MX4, 50ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP-32; Categorystorage storage; File Size451KB，20 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT4LC16M4A7TG-5S Overview

Fast Page DRAM, 16MX4, 50ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP-32

MT4LC16M4A7TG-5S Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Micron Technology
Parts packaging code	TSOP
package instruction	0.400 INCH, PLASTIC, TSOP-32
Contacts	32
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FAST PAGE
Maximum access time	50 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH
I/O type	COMMON
JESD-30 code	R-PDSO-G32
JESD-609 code	e0
length	20.96 mm
memory density	67108864 bit
Memory IC Type	FAST PAGE DRAM
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	32
word count	16777216 words
character code	16000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16MX4
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP2
Encapsulate equivalent code	TSOP32,.46
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	8192
Maximum seat height	1.2 mm
self refresh	YES
Maximum standby current	0.0005 A
Maximum slew rate	0.13 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10.16 mm

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16 MEG x 4

FPM DRAM

DRAM

FEATURES

• Single +3.3V ±0.3V power supply

• Industry-standard x4 pinout, timing, functions,

and packages

• 13 row, 11 column addresses (A7)

12 row, 12 column addresses (T8)

• High-performance CMOS silicon-gate process

• All inputs, outputs and clocks are LVTTL-compat-

ible

• FAST-PAGE-MODE (FPM) access

• 4,096-cycle CAS#-BEFORE-RAS# (CBR) REFRESH

distributed across 64ms

• Optional self refresh (S) for low-power data

retention

MT4LC16M4A7, MT4LC16M4T8

For the latest data sheet, please refer to the Micron Web

site:

www.micronsemi.com/mti/msp/html/datasheet.html

PIN ASSIGNMENT (Top View)

32-Pin SOJ

DQ0

DQ1

WE#

RAS#

32-Pin TSOP

DQ3

DQ2

CAS#

OE#

A12/NC**

A11

A10

OPTIONS

• Refresh Addressing

4,096 (4K) rows

8,192 (8K) rows

• Plastic Packages

32-pin SOJ (400 mil)

32-pin TSOP (400 mil)

• Timing

50ns access

60ns access

• Refresh Rates

Standard Refresh

Self Refresh (128ms period)

MARKING

-5

-6

None

DQ0

DQ3

DQ1

DQ2

WE#

CAS#

RAS#

OE#

A12/NC**

A11

A10

**A12 on A7 version and NC on T8 version

16 MEG x 4 FPM DRAM PART NUMBERS

PART NUMBER

MT4LC16M4A7DJ-x

MT4LC16M4A7DJ-x S

MT4LC16M4A7TG-x

MT4LC16M4A7TG-x S

MT4LC16M4T8DJ-x

MT4LC16M4T8DJ-x S

MT4LC16M4T8TG-x

MT4LC16M4T8TG-x S

x = speed

REFRESH

ADDRESSING PACKAGE REFRESH

SOJ

TSOP

SOJ

TSOP

Standard

Self

Standard

Self

Standard

Self

Standard

Self

NOTE:

1. The 16 Meg x 4 FPM DRAM base number

differentiates the offerings in one place—

MT4LC16M4A7. The fifth field distinguishes

various options: A7 designates an 8K refresh and

T8 designates a 4K refresh for FPM DRAMs.

2. The # symbol indicates signal is active LOW.

*Contact factory for availability

Part Number Example:

GENERAL DESCRIPTION

The 16 Meg x 4 DRAMs are high-speed CMOS,

dynamic random-access memory devices contain-ing

67,108,864 bits organized in a x4 configuration. The

MT4LC16M4A7 and MT4LC16M4T8 are functionally

organized as 16,777,216 locations containing four bits

each. The 16,777,216 memory locations are arranged in

8,192 rows by 2,048 columns for the MT4LC16M4A7 or

4,096 rows by 4,096 columns for the MT4LC16M4T8.

During READ or WRITE cycles, each location is uniquely

MT4LC16M4A7DJ

KEY TIMING PARAMETERS

SPEED

-5

-6

RAC

CAC

90ns

110ns

50ns

60ns

30ns

35ns

25ns

30ns

13ns

15ns

16 Meg x 4 FPM DRAM

D21_2.p65 – Rev. 5/00

Micron Technology, Inc., reserves the right to change products or specifications without notice.

MT4LC16M4A7TG-5S Related Products

	MT4LC16M4A7TG-5S	MT4LC16M4T8DJ-6S	MT4LC16M4T8DJ-5S	MT4LC16M4A7TG-5	MT4LC16M4T8TG-6S	MT4LC16M4T8TG-5S	MT4LC16M4A7DJ-5S	MT4LC16M4T8TG-5
Description	Fast Page DRAM, 16MX4, 50ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP-32	Fast Page DRAM, 16MX4, 60ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32	Fast Page DRAM, 16MX4, 50ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32	Fast Page DRAM, 16MX4, 50ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP-32	Fast Page DRAM, 16MX4, 60ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP-32	Fast Page DRAM, 16MX4, 50ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP-32	Fast Page DRAM, 16MX4, 50ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32	Fast Page DRAM, 16MX4, 50ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP-32
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology
Parts packaging code	TSOP	SOJ	SOJ	TSOP	TSOP	TSOP	SOJ	TSOP
package instruction	0.400 INCH, PLASTIC, TSOP-32	0.400 INCH, PLASTIC, SOJ-32	0.400 INCH, PLASTIC, SOJ-32	0.400 INCH, PLASTIC, TSOP-32	0.400 INCH, PLASTIC, TSOP-32	0.400 INCH, PLASTIC, TSOP-32	0.400 INCH, PLASTIC, SOJ-32	0.400 INCH, PLASTIC, TSOP-32
Contacts	32	32	32	32	32	32	32	32
Reach Compliance Code	unknown	not_compliant	unknown	unknown	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE
Maximum access time	50 ns	60 ns	50 ns	50 ns	60 ns	50 ns	50 ns	50 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDSO-G32	R-PDSO-J32	R-PDSO-J32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-J32	R-PDSO-G32
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
length	20.96 mm	20.98 mm	20.98 mm	20.96 mm	20.96 mm	20.96 mm	20.98 mm	20.96 mm
memory density	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit	67108864 bit
Memory IC Type	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM
memory width	4	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1
Number of terminals	32	32	32	32	32	32	32	32
word count	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words
character code	16000000	16000000	16000000	16000000	16000000	16000000	16000000	16000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	16MX4	16MX4	16MX4	16MX4	16MX4	16MX4	16MX4	16MX4
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP2	SOJ	SOJ	TSOP2	TSOP2	TSOP2	SOJ	TSOP2
Encapsulate equivalent code	TSOP32,.46	SOJ32,.44	SOJ32,.44	TSOP32,.46	TSOP32,.46	TSOP32,.46	SOJ32,.44	TSOP32,.46
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	8192	4096	4096	8192	4096	4096	8192	4096
Maximum seat height	1.2 mm	3.68 mm	3.68 mm	1.2 mm	1.2 mm	1.2 mm	3.68 mm	1.2 mm
self refresh	YES	YES	YES	NO	YES	YES	YES	NO
Maximum standby current	0.0005 A	0.0005 A	0.0005 A	0.0005 A	0.0005 A	0.0005 A	0.0005 A	0.0005 A
Maximum slew rate	0.13 mA	0.16 mA	0.17 mA	0.13 mA	0.16 mA	0.17 mA	0.13 mA	0.17 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	J BEND	J BEND	GULL WING	GULL WING	GULL WING	J BEND	GULL WING
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	10.16 mm	11.18 mm	11.18 mm	10.16 mm	10.16 mm	10.16 mm	11.18 mm	10.16 mm

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