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CMPDM202PH

Description
SURFACE MOUNT P-CHANNEL ENHANCEMENT-MODE SILICON MOSFET
CategoryDiscrete semiconductor    The transistor   
File Size347KB,3 Pages
ManufacturerCentral Semiconductor
Download Datasheet Parametric View All

CMPDM202PH Overview

SURFACE MOUNT P-CHANNEL ENHANCEMENT-MODE SILICON MOSFET

CMPDM202PH Parametric

Parameter NameAttribute value
MakerCentral Semiconductor
Parts packaging codeSOT-23F
package instructionSMALL OUTLINE, R-PDSO-F3
Contacts3
Reach Compliance Codecompli
ECCN codeEAR99
Other featuresLOGIC LEVEL COMPATIBLE, LOW THRESHOLD
ConfigurationSINGLE WITH BUILT-IN DIODE
Minimum drain-source breakdown voltage20 V
Maximum drain current (ID)2.3 A
Maximum drain-source on-resistance0.093 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JESD-30 codeR-PDSO-F3
Number of components1
Number of terminals3
Operating modeENHANCEMENT MODE
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Polarity/channel typeP-CHANNEL
Certification statusNot Qualified
surface mountYES
Terminal formFLAT
Terminal locationDUAL
transistor applicationsSWITCHING
Transistor component materialsSILICON
CMPDM202PH
SURFACE MOUNT
P-CHANNEL
ENHANCEMENT-MODE
SILICON MOSFET
w w w. c e n t r a l s e m i . c o m
DESCRIPTION:
The CENTRAL SEMICONDUCTOR CMPDM202PH
is a High Current P-Channel Enhancement-mode
Silicon MOSFET, manufactured by the P-Channel
DMOS Process, and is designed for high speed pulsed
amplifier and driver applications. This MOSFET offers
High Current, Low rDS(ON), Low Threshold Voltage,
and Low Leakage Current.
MARKING CODE: 202C
SOT-23F CASE
APPLICATIONS:
Load/Power switches
Power supply converter circuits
Battery powered portable equipment
MAXIMUM RATINGS:
(TA=25°C)
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Steady State)
Maximum Pulsed Drain Current, tp=10μs
Power Dissipation
Operating and Storage Junction Temperature
Thermal Resistance
FEATURES:
Low rDS(ON) (0.093Ω MAX @ VGS=2.5V)
High current (ID=2.3A)
Logic level compatibility
SYMBOL
VDS
VGS
ID
IDM
PD
TJ, Tstg
Θ
JA
20
12
2.3
9.2
350
-55 to +150
357
UNITS
V
V
A
A
mW
°C
°C/W
ELECTRICAL CHARACTERISTICS:
(TA=25°C unless otherwise noted)
SYMBOL
TEST CONDITIONS
MIN
TYP
I
GSSF, IGSSR
VGS=12V, VDS=0
IDSS
BVDSS
VGS(th)
rDS(ON)
rDS(ON)
gFS
Crss
Ciss
Coss
Qg(tot)
Qgs
Qgd
ton
toff
VDS=20V, VGS=0
VGS=0, ID=250μA
VGS=VDS, ID=250μA
VGS=5.0V, ID=1.2A
VGS=2.5V, ID=1.2A
VDS=5.0V, ID=2.3A
VDD=10V, VGS=0, f=1.0MHz
VDD=10V, VGS=0, f=1.0MHz
VDD=10V,
VDD=10V,
VGS=0, f=1.0MHz
VGS=5.0V, ID=2.3A
ID=2.3A
ID=2.3A
20
0.6
0.064
0.072
15
110
880
210
8.0
1.3
2.3
15.2
27.6
MAX
100
1.0
1.4
0.088
0.093
UNITS
nA
μA
V
V
Ω
Ω
S
pF
pF
pF
12
2.0
3.5
nC
nC
nC
ns
ns
VDD=10V, VGS=5.0V,
VDD=10V, VGS=5.0V,
VDD=10V, ID=2.3A, RG=10Ω
VDD=10V, ID=2.3A, RG=10Ω
R0 (21-October 2010)

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