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LR33020GC-25

Description
Graphics Processor, CMOS, CPGA224
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,30 Pages
ManufacturerLSC/CSI
Websitehttps://lsicsi.com
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LR33020GC-25 Overview

Graphics Processor, CMOS, CPGA224

LR33020GC-25 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerLSC/CSI
package instructionPGA, PGA224,18X18
Reach Compliance Codeunknown
JESD-30 codeS-XPGA-P224
JESD-609 codee0
Number of terminals224
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC
encapsulated codePGA
Encapsulate equivalent codePGA224,18X18
Package shapeSQUARE
Package formGRID ARRAY
power supply5 V
Certification statusNot Qualified
Maximum slew rate400 mA
Nominal supply voltage5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formPIN/PEG
Terminal pitch2.54 mm
Terminal locationPERPENDICULAR
uPs/uCs/peripheral integrated circuit typeGRAPHICS PROCESSOR

LR33020GC-25 Preview

This Material Copyrighted By Its Respective Manufacturer
This Material Copyrighted By Its Respective Manufacturer
This Material Copyrighted By Its Respective Manufacturer
This Material Copyrighted By Its Respective Manufacturer
This Material Copyrighted By Its Respective Manufacturer

LR33020GC-25 Related Products

LR33020GC-25 LR33020GC-33 LR33020GC-40 LR33020MC-25 LR33020MC-33 LR33020MC-40
Description Graphics Processor, CMOS, CPGA224 Graphics Processor, CMOS, CPGA224 Graphics Processor, CMOS, CPGA224 Graphics Processor, CMOS, MQFP208, Graphics Processor, CMOS, MQFP208 Graphics Processor, CMOS, MQFP208
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible
Maker LSC/CSI LSC/CSI LSC/CSI LSC/CSI LSC/CSI LSC/CSI
Reach Compliance Code unknown unknown unknown unknown unknown unknown
JESD-30 code S-XPGA-P224 S-XPGA-P224 S-XPGA-P224 S-MQFP-G208 S-MQFP-G208 S-MQFP-G208
JESD-609 code e0 e0 e0 e0 e0 e0
Number of terminals 224 224 224 208 208 208
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
Package body material CERAMIC CERAMIC CERAMIC METAL METAL METAL
encapsulated code PGA PGA PGA QFP QFP QFP
Encapsulate equivalent code PGA224,18X18 PGA224,18X18 PGA224,18X18 QFP208,1.2SQ,20 QFP208,1.2SQ,20 QFP208,1.2SQ,20
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY FLATPACK FLATPACK FLATPACK
power supply 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate 400 mA 500 mA 600 mA 400 mA 500 mA 600 mA
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO NO YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form PIN/PEG PIN/PEG PIN/PEG GULL WING GULL WING GULL WING
Terminal pitch 2.54 mm 2.54 mm 2.54 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location PERPENDICULAR PERPENDICULAR PERPENDICULAR QUAD QUAD QUAD
uPs/uCs/peripheral integrated circuit type GRAPHICS PROCESSOR GRAPHICS PROCESSOR GRAPHICS PROCESSOR GRAPHICS PROCESSOR GRAPHICS PROCESSOR GRAPHICS PROCESSOR
package instruction PGA, PGA224,18X18 PGA, PGA224,18X18 PGA, PGA224,18X18 QFP, QFP208,1.2SQ,20 QFP, QFP208,1.2SQ,20 -
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