LR33020MC-40 datasheet, PDF - EEWORLD Datasheet

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LR33020MC-40: DescriptionGraphics Processor, CMOS, MQFP208; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，30 Pages; ManufacturerLSC/CSI; Websitehttps://lsicsi.com

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LR33020MC-40 Overview

Graphics Processor, CMOS, MQFP208

LR33020MC-40 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	LSC/CSI
Reach Compliance Code	unknown
JESD-30 code	S-MQFP-G208
JESD-609 code	e0
Number of terminals	208
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	METAL
encapsulated code	QFP
Encapsulate equivalent code	QFP208,1.2SQ,20
Package shape	SQUARE
Package form	FLATPACK
power supply	5 V
Certification status	Not Qualified
Maximum slew rate	600 mA
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
uPs/uCs/peripheral integrated circuit type	GRAPHICS PROCESSOR

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LR33020MC-40 Related Products

	LR33020MC-40	LR33020GC-25	LR33020GC-33	LR33020GC-40	LR33020MC-25	LR33020MC-33
Description	Graphics Processor, CMOS, MQFP208	Graphics Processor, CMOS, CPGA224	Graphics Processor, CMOS, CPGA224	Graphics Processor, CMOS, CPGA224	Graphics Processor, CMOS, MQFP208,	Graphics Processor, CMOS, MQFP208
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	LSC/CSI	LSC/CSI	LSC/CSI	LSC/CSI	LSC/CSI	LSC/CSI
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 code	S-MQFP-G208	S-XPGA-P224	S-XPGA-P224	S-XPGA-P224	S-MQFP-G208	S-MQFP-G208
JESD-609 code	e0	e0	e0	e0	e0	e0
Number of terminals	208	224	224	224	208	208
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
Package body material	METAL	CERAMIC	CERAMIC	CERAMIC	METAL	METAL
encapsulated code	QFP	PGA	PGA	PGA	QFP	QFP
Encapsulate equivalent code	QFP208,1.2SQ,20	PGA224,18X18	PGA224,18X18	PGA224,18X18	QFP208,1.2SQ,20	QFP208,1.2SQ,20
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	FLATPACK	GRID ARRAY	GRID ARRAY	GRID ARRAY	FLATPACK	FLATPACK
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	600 mA	400 mA	500 mA	600 mA	400 mA	500 mA
Nominal supply voltage	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	NO	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	PIN/PEG	PIN/PEG	PIN/PEG	GULL WING	GULL WING
Terminal pitch	0.5 mm	2.54 mm	2.54 mm	2.54 mm	0.5 mm	0.5 mm
Terminal location	QUAD	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	QUAD	QUAD
uPs/uCs/peripheral integrated circuit type	GRAPHICS PROCESSOR	GRAPHICS PROCESSOR	GRAPHICS PROCESSOR	GRAPHICS PROCESSOR	GRAPHICS PROCESSOR	GRAPHICS PROCESSOR
package instruction	-	PGA, PGA224,18X18	PGA, PGA224,18X18	PGA, PGA224,18X18	QFP, QFP208,1.2SQ,20	QFP, QFP208,1.2SQ,20

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