HB56A19A-12 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > storage> storage> HB56A19A-12

HB56A19A-12: DescriptionDRAM Module, 1MX9, 120ns, CMOS, SIMM-30; Categorystorage storage; File Size202KB，7 Pages; ManufacturerHitachi （Renesas ）; Websitehttp://www.renesas.com/eng/

Download Datasheet Parametric Compare View All

HB56A19A-12 Overview

DRAM Module, 1MX9, 120ns, CMOS, SIMM-30

HB56A19A-12 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Hitachi （Renesas ）
Parts packaging code	SIMM
package instruction	, SIP30,.2
Contacts	30
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	PAGE
Maximum access time	120 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type	COMMON
JESD-30 code	R-XSMA-T30
JESD-609 code	e0
memory density	9437184 bit
Memory IC Type	DRAM MODULE
memory width	9
Number of functions	1
Number of ports	1
Number of terminals	30
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX9
Output characteristics	3-STATE
Package body material	UNSPECIFIED
Encapsulate equivalent code	SIP30,.2
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
refresh cycle	1024
Maximum seat height	20.574 mm
Maximum standby current	0.009 A
Maximum slew rate	0.45 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	SINGLE
Maximum time at peak reflow temperature	NOT SPECIFIED

Preview

Download Datasheet

View All

HB56A19A-12 Related Products

	HB56A19A-12	HB56A19B-12	HB56A19A-10	HB56A19B-10	HB56A19A-15	HB56A19B-15
Description	DRAM Module, 1MX9, 120ns, CMOS, SIMM-30	DRAM Module, 1MX9, 120ns, CMOS, SIMM-30	DRAM Module, 1MX9, 100ns, CMOS, SIMM-30	DRAM Module, 1MX9, 100ns, CMOS, SIMM-30	DRAM Module, 1MX9, 150ns, CMOS, SIMM-30	DRAM Module, 1MX9, 150ns, CMOS, SIMM-30
Maker	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）
Parts packaging code	SIMM	SIMM	SIMM	SIMM	SIMM	SIMM
package instruction	, SIP30,.2	SIMM, SIM30	, SIP30,.2	SIMM, SIM30	, SIP30,.2	SIMM, SIM30
Contacts	30	30	30	30	30	30
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	PAGE	PAGE	PAGE	PAGE	PAGE	PAGE
Maximum access time	120 ns	120 ns	100 ns	100 ns	150 ns	150 ns
Other features	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-XSMA-T30	R-XSMA-N30	R-XSMA-T30	R-XSMA-N30	R-XSMA-T30	R-XSMA-N30
memory density	9437184 bit	9437184 bit	9437184 bit	9437184 bit	9437184 bit	9437184 bi
Memory IC Type	DRAM MODULE	DRAM MODULE	DRAM MODULE	DRAM MODULE	DRAM MODULE	DRAM MODULE
memory width	9	9	9	9	9	9
Number of functions	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1
Number of terminals	30	30	30	30	30	30
word count	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	1MX9	1MX9	1MX9	1MX9	1MX9	1MX9
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
Encapsulate equivalent code	SIP30,.2	SIM30	SIP30,.2	SIM30	SIP30,.2	SIM30
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	1024	1024	1024	1024	1024	1024
Maximum seat height	20.574 mm	20.447 mm	20.574 mm	20.447 mm	20.574 mm	20.447 mm
Maximum standby current	0.009 A	0.009 A	0.009 A	0.009 A	0.009 A	0.009 A
Maximum slew rate	0.45 mA	0.45 mA	0.54 mA	0.54 mA	0.36 mA	0.36 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal form	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	NO LEAD
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE

Recommended Resources

Transformerless switching power supply circuit diagram

Boost circuit diagram using LT1073

Gas accident alarm circuit

555 ultrasonic liquid level indication circuit

555 multi-function remote control circuit

What are the specific differences between the IntEnable(INT_UART2); and UARTEnable(INT_UART2); instructions?: IntEnable(INT_UART2); //Enable UART2 interrupt UARTEnable(INT_UART2); //Enable UART2 What are the specific differences between the instructions? If after receiving data, close the UART2 port, process ...; QIHAO74 Microcontroller MCU

Urgent! Urgent! Please come in and give some advice.: I have worked on USB drivers before, and recently I am working on PCI drivers to achieve two functions: 1. PCI to 2 serial ports + 1 parallel port 2. PCI to 8 serial ports. The questions I want to ask...; cflymtk Embedded System

C5509 GPIO register definition information: The manual says: general-purpose I/O port has been moved to the device-specific data manuals. But I can't find it. If anyone has it, or a download link, please help me. Thanks a lot. [size=7] Now I ha...; jackie0025 DSP and ARM Processors

About pointer reference issues in developing WINCE programs using VS2005: I transferred the program under VC6 to VS2005, using the ARMV41 SDK compiled by myself. As a result, when debugging the program, I found that when I came to a function that needed a pointer reference ...; 19850719 Embedded System

40 experiments for beginners of microcontrollers: [font=宋体]Easily learn single chip microcomputer[/font]...; liuyanliuyan NXP MCU

The difference between domestic and imported STM32 chips: It is said that there are domestic and imported STM32 chips. What is the difference? I use a domestic chip, but IWDOG still crashes after starting. Is this a defect of the domestic chip?...; sh-caideqing stm32/stm8

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components