HM511002JP-10S datasheet, PDF - EEWORLD Datasheet

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HM511002JP-10S: DescriptionStatic Column DRAM, 1MX1, 100ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-20; Categorystorage storage; File Size336KB，15 Pages; ManufacturerHitachi （Renesas ）; Websitehttp://www.renesas.com/eng/

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HM511002JP-10S Overview

Static Column DRAM, 1MX1, 100ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-20

HM511002JP-10S Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	Hitachi （Renesas ）
Parts packaging code	SOJ
package instruction	SOJ, SOJ20/26,.34
Contacts	20
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	STATIC COLUMN
Maximum access time	100 ns
Other features	RAS ONLY/CAS BEFORE RAS REFRESH
I/O type	SEPARATE
JESD-30 code	R-PDSO-J20
JESD-609 code	e0
length	16.9 mm
memory density	1048576 bit
Memory IC Type	STATIC COLUMN DRAM
memory width	1
Number of functions	1
Number of ports	1
Number of terminals	20
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX1
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	SOJ
Encapsulate equivalent code	SOJ20/26,.34
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
refresh cycle	512
Maximum seat height	3.76 mm
Maximum standby current	0.001 A
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

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HM511002JP-10S Related Products

	HM511002JP-10S	HM511002ZP-8S	HM511002P-8S	HM511002P-12S	HM511002JP-8S	HM511002JP-12S	HM511002P-10S	HM511002ZP-10S	HM511002ZP-12S
Description	Static Column DRAM, 1MX1, 100ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-20	Static Column DRAM, 1MX1, 80ns, CMOS, PZIP20, 0.400 INCH, PLASTIC, ZIP-20	Static Column DRAM, 1MX1, 80ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18	Static Column DRAM, 1MX1, 120ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18	Static Column DRAM, 1MX1, 80ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-20	Static Column DRAM, 1MX1, 120ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-20	Static Column DRAM, 1MX1, 100ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18	Static Column DRAM, 1MX1, 100ns, CMOS, PZIP20, 0.400 INCH, PLASTIC, ZIP-20	Static Column DRAM, 1MX1, 120ns, CMOS, PZIP20, 0.400 INCH, PLASTIC, ZIP-20
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）
Parts packaging code	SOJ	ZIP	DIP	DIP	SOJ	SOJ	DIP	ZIP	ZIP
package instruction	SOJ, SOJ20/26,.34	0.400 INCH, PLASTIC, ZIP-20	DIP, DIP18,.3	DIP, DIP18,.3	SOJ, SOJ20/26,.34	SOJ, SOJ20/26,.34	DIP, DIP18,.3	ZIP, ZIP20,.1	ZIP, ZIP20,.1
Contacts	20	20	18	18	20	20	18	20	20
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	STATIC COLUMN	STATIC COLUMN	STATIC COLUMN	STATIC COLUMN	STATIC COLUMN	STATIC COLUMN	STATIC COLUMN	STATIC COLUMN	STATIC COLUMN
Maximum access time	100 ns	80 ns	80 ns	120 ns	80 ns	120 ns	100 ns	100 ns	120 ns
Other features	RAS ONLY/CAS BEFORE RAS REFRESH	RAS ONLY/CAS BEFORE RAS REFRESH	RAS ONLY/CAS BEFORE RAS REFRESH	RAS ONLY/CAS BEFORE RAS REFRESH	RAS ONLY/CAS BEFORE RAS REFRESH	RAS ONLY/CAS BEFORE RAS REFRESH	RAS ONLY/CAS BEFORE RAS REFRESH	RAS ONLY/CAS BEFORE RAS REFRESH	RAS ONLY/CAS BEFORE RAS REFRESH
I/O type	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE	SEPARATE
JESD-30 code	R-PDSO-J20	R-PZIP-T20	R-PDIP-T18	R-PDIP-T18	R-PDSO-J20	R-PDSO-J20	R-PDIP-T18	R-PZIP-T20	R-PZIP-T20
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	16.9 mm	25.61 mm	22.26 mm	22.26 mm	16.9 mm	16.9 mm	22.26 mm	25.61 mm	25.61 mm
memory density	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit
Memory IC Type	STATIC COLUMN DRAM	STATIC COLUMN DRAM	STATIC COLUMN DRAM	STATIC COLUMN DRAM	STATIC COLUMN DRAM	STATIC COLUMN DRAM	STATIC COLUMN DRAM	STATIC COLUMN DRAM	STATIC COLUMN DRAM
memory width	1	1	1	1	1	1	1	1	1
Number of functions	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1
Number of terminals	20	20	18	18	20	20	18	20	20
word count	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	1MX1	1MX1	1MX1	1MX1	1MX1	1MX1	1MX1	1MX1	1MX1
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	SOJ	ZIP	DIP	DIP	SOJ	SOJ	DIP	ZIP	ZIP
Encapsulate equivalent code	SOJ20/26,.34	ZIP20,.1	DIP18,.3	DIP18,.3	SOJ20/26,.34	SOJ20/26,.34	DIP18,.3	ZIP20,.1	ZIP20,.1
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
refresh cycle	512	512	512	512	512	512	512	512	512
Maximum seat height	3.76 mm	10.16 mm	5.08 mm	5.08 mm	3.76 mm	3.76 mm	5.08 mm	10.16 mm	10.16 mm
Maximum standby current	0.001 A	0.001 A	0.001 A	0.001 A	0.001 A	0.001 A	0.001 A	0.001 A	0.001 A
Maximum slew rate	0.06 mA	0.07 mA	0.07 mA	0.05 mA	0.07 mA	0.05 mA	0.06 mA	0.06 mA	0.05 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	YES	NO	NO	NO	YES	YES	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm
Terminal location	DUAL	ZIG-ZAG	DUAL	DUAL	DUAL	DUAL	DUAL	ZIG-ZAG	ZIG-ZAG
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	2.85 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	2.85 mm	2.85 mm

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