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HM511002P-10S

Description
Static Column DRAM, 1MX1, 100ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18
Categorystorage    storage   
File Size336KB,15 Pages
ManufacturerHitachi (Renesas )
Websitehttp://www.renesas.com/eng/
Download Datasheet Parametric Compare View All

HM511002P-10S Overview

Static Column DRAM, 1MX1, 100ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18

HM511002P-10S Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerHitachi (Renesas )
Parts packaging codeDIP
package instructionDIP, DIP18,.3
Contacts18
Reach Compliance Codeunknown
ECCN codeEAR99
access modeSTATIC COLUMN
Maximum access time100 ns
Other featuresRAS ONLY/CAS BEFORE RAS REFRESH
I/O typeSEPARATE
JESD-30 codeR-PDIP-T18
JESD-609 codee0
length22.26 mm
memory density1048576 bit
Memory IC TypeSTATIC COLUMN DRAM
memory width1
Number of functions1
Number of ports1
Number of terminals18
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize1MX1
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP18,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
refresh cycle512
Maximum seat height5.08 mm
Maximum standby current0.001 A
Maximum slew rate0.06 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.62 mm

HM511002P-10S Related Products

HM511002P-10S HM511002ZP-8S HM511002JP-10S HM511002P-8S HM511002P-12S HM511002JP-8S HM511002JP-12S HM511002ZP-10S HM511002ZP-12S
Description Static Column DRAM, 1MX1, 100ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 Static Column DRAM, 1MX1, 80ns, CMOS, PZIP20, 0.400 INCH, PLASTIC, ZIP-20 Static Column DRAM, 1MX1, 100ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-20 Static Column DRAM, 1MX1, 80ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 Static Column DRAM, 1MX1, 120ns, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 Static Column DRAM, 1MX1, 80ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-20 Static Column DRAM, 1MX1, 120ns, CMOS, PDSO20, 0.300 INCH, PLASTIC, SOJ-20 Static Column DRAM, 1MX1, 100ns, CMOS, PZIP20, 0.400 INCH, PLASTIC, ZIP-20 Static Column DRAM, 1MX1, 120ns, CMOS, PZIP20, 0.400 INCH, PLASTIC, ZIP-20
Is it lead-free? Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead Contains lead
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Maker Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas ) Hitachi (Renesas )
Parts packaging code DIP ZIP SOJ DIP DIP SOJ SOJ ZIP ZIP
package instruction DIP, DIP18,.3 0.400 INCH, PLASTIC, ZIP-20 SOJ, SOJ20/26,.34 DIP, DIP18,.3 DIP, DIP18,.3 SOJ, SOJ20/26,.34 SOJ, SOJ20/26,.34 ZIP, ZIP20,.1 ZIP, ZIP20,.1
Contacts 18 20 20 18 18 20 20 20 20
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode STATIC COLUMN STATIC COLUMN STATIC COLUMN STATIC COLUMN STATIC COLUMN STATIC COLUMN STATIC COLUMN STATIC COLUMN STATIC COLUMN
Maximum access time 100 ns 80 ns 100 ns 80 ns 120 ns 80 ns 120 ns 100 ns 120 ns
Other features RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH RAS ONLY/CAS BEFORE RAS REFRESH
I/O type SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE SEPARATE
JESD-30 code R-PDIP-T18 R-PZIP-T20 R-PDSO-J20 R-PDIP-T18 R-PDIP-T18 R-PDSO-J20 R-PDSO-J20 R-PZIP-T20 R-PZIP-T20
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0
length 22.26 mm 25.61 mm 16.9 mm 22.26 mm 22.26 mm 16.9 mm 16.9 mm 25.61 mm 25.61 mm
memory density 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit 1048576 bit
Memory IC Type STATIC COLUMN DRAM STATIC COLUMN DRAM STATIC COLUMN DRAM STATIC COLUMN DRAM STATIC COLUMN DRAM STATIC COLUMN DRAM STATIC COLUMN DRAM STATIC COLUMN DRAM STATIC COLUMN DRAM
memory width 1 1 1 1 1 1 1 1 1
Number of functions 1 1 1 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1 1 1 1
Number of terminals 18 20 20 18 18 20 20 20 20
word count 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000 1000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 1MX1 1MX1 1MX1 1MX1 1MX1 1MX1 1MX1 1MX1 1MX1
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP ZIP SOJ DIP DIP SOJ SOJ ZIP ZIP
Encapsulate equivalent code DIP18,.3 ZIP20,.1 SOJ20/26,.34 DIP18,.3 DIP18,.3 SOJ20/26,.34 SOJ20/26,.34 ZIP20,.1 ZIP20,.1
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form IN-LINE IN-LINE SMALL OUTLINE IN-LINE IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
refresh cycle 512 512 512 512 512 512 512 512 512
Maximum seat height 5.08 mm 10.16 mm 3.76 mm 5.08 mm 5.08 mm 3.76 mm 3.76 mm 10.16 mm 10.16 mm
Maximum standby current 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A 0.001 A
Maximum slew rate 0.06 mA 0.07 mA 0.06 mA 0.07 mA 0.05 mA 0.07 mA 0.05 mA 0.06 mA 0.05 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount NO NO YES NO NO YES YES NO NO
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE THROUGH-HOLE J BEND THROUGH-HOLE THROUGH-HOLE J BEND J BEND THROUGH-HOLE THROUGH-HOLE
Terminal pitch 2.54 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL ZIG-ZAG DUAL DUAL DUAL DUAL DUAL ZIG-ZAG ZIG-ZAG
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 7.62 mm 2.85 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.62 mm 2.85 mm 2.85 mm
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