300 mA, 60 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-236
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | SOT-23 |
| package instruction | SMALL OUTLINE, R-PDSO-G3 |
| Contacts | 3 |
| Reach Compliance Code | compli |
| ECCN code | EAR99 |
| Configuration | SINGLE WITH BUILT-IN DIODE |
| Minimum drain-source breakdown voltage | 60 V |
| Maximum drain current (Abs) (ID) | 0.3 A |
| Maximum drain current (ID) | 0.3 A |
| Maximum drain-source on-resistance | 7.5 Ω |
| FET technology | METAL-OXIDE SEMICONDUCTOR |
| Maximum feedback capacitance (Crss) | 5 pF |
| JEDEC-95 code | TO-236 |
| JESD-30 code | R-PDSO-G3 |
| Number of components | 1 |
| Number of terminals | 3 |
| Operating mode | ENHANCEMENT MODE |
| Maximum operating temperature | 150 °C |
| Package body material | PLASTIC/EPOXY |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Polarity/channel type | N-CHANNEL |
| Maximum power dissipation(Abs) | 0.2 W |
| Certification status | Not Qualified |
| surface mount | YES |
| Terminal form | GULL WING |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| transistor applications | SWITCHING |
| Transistor component materials | SILICON |
| Base Number Matches | 1 |
| 2N7002G-AE2-R | 2N7002 | 2N7002L-AE2-R | 2N7002_11 | |
|---|---|---|---|---|
| Description | 300 mA, 60 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-236 | 300 mA, 60 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET | 300 mA, 60 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-236 | 300 mA, 60 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET |
| Number of components | 1 | 1 | 1 | 1 |
| Number of terminals | 3 | 3 | 3 | 3 |
| surface mount | YES | YES | YES | Yes |
| Terminal form | GULL WING | FLAT | GULL WING | GULL WING |
| Terminal location | DUAL | DUAL | DUAL | pair |
| transistor applications | SWITCHING | SWITCHING | SWITCHING | switch |
| Transistor component materials | SILICON | SILICON | SILICON | silicon |
| package instruction | SMALL OUTLINE, R-PDSO-G3 | SMALL OUTLINE, R-PDSO-F3 | SMALL OUTLINE, R-PDSO-G3 | - |
| Reach Compliance Code | compli | compli | compli | - |
| Configuration | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | - |
| Minimum drain-source breakdown voltage | 60 V | 60 V | 60 V | - |
| Maximum drain current (Abs) (ID) | 0.3 A | 0.115 A | 0.3 A | - |
| Maximum drain current (ID) | 0.3 A | 0.115 A | 0.3 A | - |
| Maximum drain-source on-resistance | 7.5 Ω | 7.5 Ω | 7.5 Ω | - |
| FET technology | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | - |
| Maximum feedback capacitance (Crss) | 5 pF | 5 pF | 5 pF | - |
| JESD-30 code | R-PDSO-G3 | R-PDSO-F3 | R-PDSO-G3 | - |
| Operating mode | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | - |
| Maximum operating temperature | 150 °C | 150 °C | 150 °C | - |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - |
| Polarity/channel type | N-CHANNEL | N-CHANNEL | N-CHANNEL | - |
| Maximum power dissipation(Abs) | 0.2 W | 0.2 W | 0.2 W | - |