KM64B66P-15 datasheet, PDF - EEWORLD Datasheet

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KM64B66P-15: DescriptionStandard SRAM, 16KX4, 15ns, BICMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24; Categorystorage storage; File Size149KB，6 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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KM64B66P-15 Overview

Standard SRAM, 16KX4, 15ns, BICMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24

KM64B66P-15 Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	SAMSUNG
Parts packaging code	DIP
package instruction	DIP, DIP24,.3
Contacts	24
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	15 ns
I/O type	COMMON
JESD-30 code	R-PDIP-T24
JESD-609 code	e0
length	31.625 mm
memory density	65536 bit
Memory IC Type	STANDARD SRAM
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	24
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16KX4
Output characteristics	3-STATE
Exportable	YES
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.3
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.08 mm
Maximum standby current	0.008 A
Maximum slew rate	0.12 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	BICMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	7.62 mm

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KM64B66P-15 Related Products

	KM64B66P-15	KM64B66P-10	KM64B66P-12	KM64B66J-20	KM64B66J-12	KM64B66J-10	KM64B66J-15	KM64B66P-20
Description	Standard SRAM, 16KX4, 15ns, BICMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24	Standard SRAM, 16KX4, 10ns, BICMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24	Standard SRAM, 16KX4, 12ns, BICMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24	Standard SRAM, 16KX4, 20ns, BICMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24	Standard SRAM, 16KX4, 12ns, BICMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24	Standard SRAM, 16KX4, 10ns, BICMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24	Standard SRAM, 16KX4, 15ns, BICMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24	Standard SRAM, 16KX4, 20ns, BICMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	DIP	DIP	SOJ	SOJ	SOJ	SOJ	DIP
package instruction	DIP, DIP24,.3	DIP, DIP24,.3	DIP, DIP24,.3	SOJ, SOJ24,.34	SOJ, SOJ24,.34	SOJ, SOJ24,.34	SOJ, SOJ24,.34	DIP, DIP24,.3
Contacts	24	24	24	24	24	24	24	24
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	15 ns	10 ns	12 ns	20 ns	12 ns	10 ns	15 ns	20 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PDIP-T24	R-PDIP-T24	R-PDIP-T24	R-PDSO-J24	R-PDSO-J24	R-PDSO-J24	R-PDSO-J24	R-PDIP-T24
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0
length	31.625 mm	31.625 mm	31.625 mm	15.875 mm	15.875 mm	15.875 mm	15.875 mm	31.625 mm
memory density	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bit	65536 bi
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	4	4	4	4	4	4	4	4
Number of functions	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1
Number of terminals	24	24	24	24	24	24	24	24
word count	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words	16384 words
character code	16000	16000	16000	16000	16000	16000	16000	16000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	16KX4	16KX4	16KX4	16KX4	16KX4	16KX4	16KX4	16KX4
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Exportable	YES	YES	YES	YES	YES	YES	YES	YES
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	DIP	DIP	DIP	SOJ	SOJ	SOJ	SOJ	DIP
Encapsulate equivalent code	DIP24,.3	DIP24,.3	DIP24,.3	SOJ24,.34	SOJ24,.34	SOJ24,.34	SOJ24,.34	DIP24,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	IN-LINE	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.08 mm	5.08 mm	5.08 mm	3.05 mm	3.05 mm	3.05 mm	3.05 mm	5.08 mm
Maximum standby current	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A	0.008 A
Maximum slew rate	0.12 mA	0.16 mA	0.14 mA	0.1 mA	0.14 mA	0.16 mA	0.12 mA	0.1 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	YES	YES	YES	YES	NO
technology	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS	BICMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	J BEND	J BEND	J BEND	J BEND	THROUGH-HOLE
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm	7.62 mm
Maker	SAMSUNG	-	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG

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