Standard SRAM, 16KX4, 15ns, BICMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | SAMSUNG |
| Parts packaging code | SOJ |
| package instruction | SOJ, SOJ24,.34 |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 15 ns |
| I/O type | COMMON |
| JESD-30 code | R-PDSO-J24 |
| JESD-609 code | e0 |
| length | 15.875 mm |
| memory density | 65536 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 4 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 24 |
| word count | 16384 words |
| character code | 16000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 16KX4 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOJ |
| Encapsulate equivalent code | SOJ24,.34 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 3.05 mm |
| Maximum standby current | 0.008 A |
| Maximum slew rate | 0.12 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | BICMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| KM64B66J-15 | KM64B66P-10 | KM64B66P-12 | KM64B66J-20 | KM64B66P-15 | KM64B66J-12 | KM64B66J-10 | KM64B66P-20 | |
|---|---|---|---|---|---|---|---|---|
| Description | Standard SRAM, 16KX4, 15ns, BICMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 | Standard SRAM, 16KX4, 10ns, BICMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Standard SRAM, 16KX4, 12ns, BICMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Standard SRAM, 16KX4, 20ns, BICMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 | Standard SRAM, 16KX4, 15ns, BICMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Standard SRAM, 16KX4, 12ns, BICMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 | Standard SRAM, 16KX4, 10ns, BICMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 | Standard SRAM, 16KX4, 20ns, BICMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Parts packaging code | SOJ | DIP | DIP | SOJ | DIP | SOJ | SOJ | DIP |
| package instruction | SOJ, SOJ24,.34 | DIP, DIP24,.3 | DIP, DIP24,.3 | SOJ, SOJ24,.34 | DIP, DIP24,.3 | SOJ, SOJ24,.34 | SOJ, SOJ24,.34 | DIP, DIP24,.3 |
| Contacts | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 15 ns | 10 ns | 12 ns | 20 ns | 15 ns | 12 ns | 10 ns | 20 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-PDSO-J24 | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-J24 | R-PDIP-T24 | R-PDSO-J24 | R-PDSO-J24 | R-PDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 15.875 mm | 31.625 mm | 31.625 mm | 15.875 mm | 31.625 mm | 15.875 mm | 15.875 mm | 31.625 mm |
| memory density | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bi |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| word count | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words |
| character code | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Exportable | YES | YES | YES | YES | YES | YES | YES | YES |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOJ | DIP | DIP | SOJ | DIP | SOJ | SOJ | DIP |
| Encapsulate equivalent code | SOJ24,.34 | DIP24,.3 | DIP24,.3 | SOJ24,.34 | DIP24,.3 | SOJ24,.34 | SOJ24,.34 | DIP24,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 3.05 mm | 5.08 mm | 5.08 mm | 3.05 mm | 5.08 mm | 3.05 mm | 3.05 mm | 5.08 mm |
| Maximum standby current | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A | 0.008 A |
| Maximum slew rate | 0.12 mA | 0.16 mA | 0.14 mA | 0.1 mA | 0.12 mA | 0.14 mA | 0.16 mA | 0.1 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO | YES | NO | YES | YES | NO |
| technology | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS | BICMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| Maker | SAMSUNG | - | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG |
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