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CY8C24794-24LFXI

Description
MULTIFUNCTION PERIPHERAL, QCC56, 8 X 8 MM, LEAD FREE, MO-220, QFN-56
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,52 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
Environmental Compliance  
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CY8C24794-24LFXI Overview

MULTIFUNCTION PERIPHERAL, QCC56, 8 X 8 MM, LEAD FREE, MO-220, QFN-56

CY8C24794-24LFXI Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerRochester Electronics
Parts packaging codeQFN
package instructionHVQCCN,
Contacts56
Reach Compliance Codeunknown
Other featuresIT ALSO OPERATES AT 3 V MINIMUM SUPPLY
Address bus width
boundary scanNO
Bus compatibilityI2C; USB
maximum clock frequency24 MHz
External data bus width
JESD-30 codeS-XQCC-N56
length8 mm
Humidity sensitivity levelNOT SPECIFIED
Number of I/O lines50
Number of terminals56
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialUNSPECIFIED
encapsulated codeHVQCCN
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)260
RAM (number of words)1000
Maximum seat height1 mm
Maximum supply voltage5.25 V
Minimum supply voltage4.75 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNOT SPECIFIED
Terminal formNO LEAD
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature20
width8 mm
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CY8C24794-24LFXI Related Products

CY8C24794-24LFXI CY8C24994-24BVXI CY8C24894-24LFXI
Description MULTIFUNCTION PERIPHERAL, QCC56, 8 X 8 MM, LEAD FREE, MO-220, QFN-56 MULTIFUNCTION PERIPHERAL, PBGA100, 6 X 6 MM, LEAD FREE, MO-195C, VFBGA-100 MULTIFUNCTION PERIPHERAL, QCC56, 8 X 8 MM, LEAD FREE, MO-220, QFN-56
Is it lead-free? Lead free Lead free Lead free
Is it Rohs certified? conform to conform to conform to
Maker Rochester Electronics Rochester Electronics Rochester Electronics
Parts packaging code QFN BGA QFN
package instruction HVQCCN, VFBGA, HVQCCN,
Contacts 56 100 56
Reach Compliance Code unknown unknown unknown
Other features IT ALSO OPERATES AT 3 V MINIMUM SUPPLY IT ALSO OPERATES AT 3 V MINIMUM SUPPLY IT ALSO OPERATES AT 3 V MINIMUM SUPPLY
boundary scan NO NO NO
Bus compatibility I2C; USB I2C; USB I2C; USB
maximum clock frequency 24 MHz 24 MHz 24 MHz
JESD-30 code S-XQCC-N56 S-PBGA-B100 S-XQCC-N56
length 8 mm 6 mm 8 mm
Humidity sensitivity level NOT SPECIFIED 3 3
Number of I/O lines 50 56 49
Number of terminals 56 100 56
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C
Package body material UNSPECIFIED PLASTIC/EPOXY UNSPECIFIED
encapsulated code HVQCCN VFBGA HVQCCN
Package shape SQUARE SQUARE SQUARE
Package form CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) 260 260 260
RAM (number of words) 1000 1000 1000
Maximum seat height 1 mm 1 mm 1 mm
Maximum supply voltage 5.25 V 5.25 V 5.25 V
Minimum supply voltage 4.75 V 4.75 V 4.75 V
Nominal supply voltage 5 V 5 V 5 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface NOT SPECIFIED TIN SILVER COPPER MATTE TIN
Terminal form NO LEAD BALL NO LEAD
Terminal pitch 0.5 mm 0.5 mm 0.5 mm
Terminal location QUAD BOTTOM QUAD
Maximum time at peak reflow temperature 20 20 40
width 8 mm 6 mm 8 mm
JESD-609 code - e1 e3
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