CY8C24894-24LFXI datasheet, PDF

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CY8C24894-24LFXI: DescriptionMULTIFUNCTION PERIPHERAL, QCC56, 8 X 8 MM, LEAD FREE, MO-220, QFN-56; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，52 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/; Environmental Compliance

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CY8C24894-24LFXI Overview

MULTIFUNCTION PERIPHERAL, QCC56, 8 X 8 MM, LEAD FREE, MO-220, QFN-56

CY8C24894-24LFXI Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Rochester Electronics
Parts packaging code	QFN
package instruction	HVQCCN,
Contacts	56
Reach Compliance Code	unknown
Other features	IT ALSO OPERATES AT 3 V MINIMUM SUPPLY
Address bus width
boundary scan	NO
Bus compatibility	I2C; USB
maximum clock frequency	24 MHz
External data bus width
JESD-30 code	S-XQCC-N56
JESD-609 code	e3
length	8 mm
Humidity sensitivity level	3
Number of I/O lines	49
Number of terminals	56
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	HVQCCN
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260
RAM (number of words)	1000
Maximum seat height	1 mm
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	MATTE TIN
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	40
width	8 mm

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CY8C24894-24LFXI Related Products

	CY8C24894-24LFXI	CY8C24994-24BVXI	CY8C24794-24LFXI
Description	MULTIFUNCTION PERIPHERAL, QCC56, 8 X 8 MM, LEAD FREE, MO-220, QFN-56	MULTIFUNCTION PERIPHERAL, PBGA100, 6 X 6 MM, LEAD FREE, MO-195C, VFBGA-100	MULTIFUNCTION PERIPHERAL, QCC56, 8 X 8 MM, LEAD FREE, MO-220, QFN-56
Is it lead-free?	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to
Maker	Rochester Electronics	Rochester Electronics	Rochester Electronics
Parts packaging code	QFN	BGA	QFN
package instruction	HVQCCN,	VFBGA,	HVQCCN,
Contacts	56	100	56
Reach Compliance Code	unknown	unknown	unknown
Other features	IT ALSO OPERATES AT 3 V MINIMUM SUPPLY	IT ALSO OPERATES AT 3 V MINIMUM SUPPLY	IT ALSO OPERATES AT 3 V MINIMUM SUPPLY
boundary scan	NO	NO	NO
Bus compatibility	I2C; USB	I2C; USB	I2C; USB
maximum clock frequency	24 MHz	24 MHz	24 MHz
JESD-30 code	S-XQCC-N56	S-PBGA-B100	S-XQCC-N56
length	8 mm	6 mm	8 mm
Humidity sensitivity level	3	3	NOT SPECIFIED
Number of I/O lines	49	56	50
Number of terminals	56	100	56
Maximum operating temperature	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C
Package body material	UNSPECIFIED	PLASTIC/EPOXY	UNSPECIFIED
encapsulated code	HVQCCN	VFBGA	HVQCCN
Package shape	SQUARE	SQUARE	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	260	260	260
RAM (number of words)	1000	1000	1000
Maximum seat height	1 mm	1 mm	1 mm
Maximum supply voltage	5.25 V	5.25 V	5.25 V
Minimum supply voltage	4.75 V	4.75 V	4.75 V
Nominal supply voltage	5 V	5 V	5 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	MATTE TIN	TIN SILVER COPPER	NOT SPECIFIED
Terminal form	NO LEAD	BALL	NO LEAD
Terminal pitch	0.5 mm	0.5 mm	0.5 mm
Terminal location	QUAD	BOTTOM	QUAD
Maximum time at peak reflow temperature	40	20	20
width	8 mm	6 mm	8 mm
JESD-609 code	e3	e1	-

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