OTP ROM, 1KX8, 45ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Cypress Semiconductor |
| Parts packaging code | DIP |
| package instruction | DIP, DIP24,.6 |
| Contacts | 24 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum access time | 45 ns |
| JESD-30 code | R-PDIP-T24 |
| JESD-609 code | e0 |
| length | 31.623 mm |
| memory density | 8192 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 24 |
| word count | 1024 words |
| character code | 1000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 1KX8 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP24,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Maximum standby current | 0.09 A |
| Maximum slew rate | 0.09 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |

| CY7C282A-45PC | CY7C281A-45KMB | CY7C281A-45DMB | CY7C282A-30DMB | CY7C281A-45JC | CY7C281A-45DC | ||
|---|---|---|---|---|---|---|---|
| Description | OTP ROM, 1KX8, 45ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24 | OTP ROM, 1KX8, 45ns, CMOS, CDFP24, CERPACK-24 | OTP ROM, 1KX8, 45ns, CMOS, CDIP24, 0.300 INCH, SLIM, CERDIP-24 | OTP ROM, 1KX8, 30ns, CMOS, CDIP24, 0.600 INCH, CERDIP-24 | OTP ROM, 1KX8, 45ns, CMOS, PQCC28, PLASTIC, LCC-28 | OTP ROM, 1KX8, 45ns, CMOS, CDIP24, 0.300 INCH, SLIM, CERDIP-24 | |
| Is it Rohs certified? | incompatible | - | incompatible | incompatible | incompatible | incompatible | |
| Maker | Cypress Semiconductor | - | - | Cypress Semiconductor | Cypress Semiconductor | Cypress Semiconductor | |
| Parts packaging code | DIP | DFP | DIP | DIP | QLCC | DIP | |
| package instruction | DIP, DIP24,.6 | DFP, FL24,.4 | DIP, DIP24,.3 | DIP, DIP24,.6 | PLASTIC, LCC-28 | DIP, DIP24,.3 | |
| Contacts | 24 | 24 | 24 | 24 | 28 | 24 | |
| Reach Compliance Code | not_compliant | compliant | not_compliant | not_compliant | not_compliant | not_compliant | |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | |
| Maximum access time | 45 ns | 45 ns | 45 ns | 30 ns | 45 ns | 45 ns | |
| JESD-30 code | R-PDIP-T24 | R-GDFP-F24 | R-GDIP-T24 | R-GDIP-T24 | S-PQCC-J28 | R-GDIP-T24 | |
| JESD-609 code | e0 | - | e0 | e0 | e0 | e0 | |
| length | 31.623 mm | 15.367 mm | 31.877 mm | 31.877 mm | 11.5316 mm | 31.877 mm | |
| memory density | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | |
| Memory IC Type | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | |
| Number of terminals | 24 | 24 | 24 | 24 | 28 | 24 | |
| word count | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | |
| character code | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | |
| Maximum operating temperature | 70 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | |
| organize | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | |
| Package body material | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | |
| encapsulated code | DIP | DFP | DIP | DIP | QCCJ | DIP | |
| Encapsulate equivalent code | DIP24,.6 | FL24,.4 | DIP24,.3 | DIP24,.6 | LDCC28,.5SQ | DIP24,.3 | |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | |
| Package form | IN-LINE | FLATPACK | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | |
| Maximum seat height | 5.08 mm | 2.286 mm | 5.08 mm | 5.715 mm | 4.572 mm | 5.08 mm | |
| Maximum standby current | 0.09 A | 0.12 A | 0.12 A | 0.12 A | 0.09 A | 0.09 A | |
| Maximum slew rate | 0.09 mA | 0.12 mA | 0.12 mA | 0.12 mA | 0.09 mA | 0.09 mA | |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | |
| surface mount | NO | YES | NO | NO | YES | NO | |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | |
| Temperature level | COMMERCIAL | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | |
| Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | |
| Terminal form | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | |
| Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | |
| Terminal location | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | |
| width | 15.24 mm | 9.652 mm | 7.62 mm | 15.24 mm | 11.5316 mm | 7.62 mm |