CY7C282A-30DMB datasheet, PDF - EEWORLD Datasheet

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CY7C282A-30DMB: DescriptionOTP ROM, 1KX8, 30ns, CMOS, CDIP24, 0.600 INCH, CERDIP-24; Categorystorage storage; File Size188KB，6 Pages; ManufacturerCypress Semiconductor

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CY7C282A-30DMB Overview

OTP ROM, 1KX8, 30ns, CMOS, CDIP24, 0.600 INCH, CERDIP-24

CY7C282A-30DMB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Cypress Semiconductor
Parts packaging code	DIP
package instruction	DIP, DIP24,.6
Contacts	24
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	30 ns
JESD-30 code	R-GDIP-T24
JESD-609 code	e0
length	31.877 mm
memory density	8192 bit
Memory IC Type	OTP ROM
memory width	8
Number of functions	1
Number of terminals	24
word count	1024 words
character code	1000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	1KX8
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DIP
Encapsulate equivalent code	DIP24,.6
Package shape	RECTANGULAR
Package form	IN-LINE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum seat height	5.715 mm
Maximum standby current	0.12 A
Maximum slew rate	0.12 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15.24 mm

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CY7C282A-30DMB Related Products

	CY7C282A-30DMB	CY7C281A-45KMB	CY7C281A-45DMB	CY7C282A-45PC	CY7C281A-45JC	CY7C281A-45DC
Description	OTP ROM, 1KX8, 30ns, CMOS, CDIP24, 0.600 INCH, CERDIP-24	OTP ROM, 1KX8, 45ns, CMOS, CDFP24, CERPACK-24	OTP ROM, 1KX8, 45ns, CMOS, CDIP24, 0.300 INCH, SLIM, CERDIP-24	OTP ROM, 1KX8, 45ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24	OTP ROM, 1KX8, 45ns, CMOS, PQCC28, PLASTIC, LCC-28	OTP ROM, 1KX8, 45ns, CMOS, CDIP24, 0.300 INCH, SLIM, CERDIP-24
Is it Rohs certified?	incompatible	-	incompatible	incompatible	incompatible	incompatible
Maker	Cypress Semiconductor	-	-	Cypress Semiconductor	Cypress Semiconductor	Cypress Semiconductor
Parts packaging code	DIP	DFP	DIP	DIP	QLCC	DIP
package instruction	DIP, DIP24,.6	DFP, FL24,.4	DIP, DIP24,.3	DIP, DIP24,.6	PLASTIC, LCC-28	DIP, DIP24,.3
Contacts	24	24	24	24	28	24
Reach Compliance Code	not_compliant	compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	30 ns	45 ns	45 ns	45 ns	45 ns	45 ns
JESD-30 code	R-GDIP-T24	R-GDFP-F24	R-GDIP-T24	R-PDIP-T24	S-PQCC-J28	R-GDIP-T24
JESD-609 code	e0	-	e0	e0	e0	e0
length	31.877 mm	15.367 mm	31.877 mm	31.623 mm	11.5316 mm	31.877 mm
memory density	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit	8192 bit
Memory IC Type	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
memory width	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1
Number of terminals	24	24	24	24	28	24
word count	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words
character code	1000	1000	1000	1000	1000	1000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	70 °C	70 °C	70 °C
organize	1KX8	1KX8	1KX8	1KX8	1KX8	1KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, GLASS-SEALED
encapsulated code	DIP	DFP	DIP	DIP	QCCJ	DIP
Encapsulate equivalent code	DIP24,.6	FL24,.4	DIP24,.3	DIP24,.6	LDCC28,.5SQ	DIP24,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
Package form	IN-LINE	FLATPACK	IN-LINE	IN-LINE	CHIP CARRIER	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.715 mm	2.286 mm	5.08 mm	5.08 mm	4.572 mm	5.08 mm
Maximum standby current	0.12 A	0.12 A	0.12 A	0.09 A	0.09 A	0.09 A
Maximum slew rate	0.12 mA	0.12 mA	0.12 mA	0.09 mA	0.09 mA	0.09 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	NO	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	FLAT	THROUGH-HOLE	THROUGH-HOLE	J BEND	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL	QUAD	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	15.24 mm	9.652 mm	7.62 mm	15.24 mm	11.5316 mm	7.62 mm

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